MT41J128M16JT-125:K TR
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Micron Technology Inc. MT41J128M16JT-125:K TR

Manufacturer No:
MT41J128M16JT-125:K TR
Manufacturer:
Micron Technology Inc.
Package:
Tape & Reel (TR)
Description:
IC DRAM 2GBIT PARALLEL 96FBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The Micron MT41J128M16JT-125:K TR is a high-performance DDR3 SDRAM memory module designed by Micron Technology Inc. This module features a capacity of 2 GB, organized as 128M x 16 bits, and operates at a clock frequency of 1600 MHz. It is housed in a 96-pin Fine-Pitch Ball Grid Array (FBGA) package, making it suitable for a wide range of applications requiring high-speed and reliable memory solutions.

The module is compliant with the DDR3 SDRAM standard and supports various advanced features such as on-die termination, write leveling, and dynamic power management. It also includes an integrated thermal sensor to optimize system performance and reliability in high-temperature environments.

Key Specifications

Parameter Value
Memory Type DDR3 SDRAM
Memory Size 2 Gb (128M x 16)
Operating Voltage 1.5V ±0.075V
Clock Frequency 1600 MHz
Max Frequency 1.6 GHz
CAS Latency (CL) 11 cycles
Operating Temperature 0°C to 95°C
Package/Case 96-TFBGA (8mm x 14mm)
Number of Pins 96
Interface Parallel
Memory Bus Width 64 bits

Key Features

  • On-die termination (ODT) for data, strobe, and mask signals
  • Write leveling and dynamic power management
  • Integrated thermal sensor for optimizing system performance and reliability
  • Programmable CAS READ latency (CL) and CAS WRITE latency (CWL)
  • Fixed burst length (BL) of 8 and burst chop (BC) of 4
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Self refresh mode and automatic self refresh (ASR)
  • Differential bidirectional data strobe and differential clock inputs (CK, CK#)
  • 8 internal banks

Applications

The Micron MT41J128M16JT-125:K TR is suitable for a wide range of applications, including:

  • Networking equipment
  • Storage systems
  • Industrial automation
  • High-performance computing
  • Embedded systems requiring reliable and high-speed memory

Q & A

  1. What is the memory capacity of the MT41J128M16JT-125:K TR?

    The memory capacity is 2 GB, organized as 128M x 16 bits.

  2. What is the operating voltage of the MT41J128M16JT-125:K TR?

    The operating voltage is 1.5V ±0.075V.

  3. What is the maximum clock frequency of the MT41J128M16JT-125:K TR?

    The maximum clock frequency is 1600 MHz.

  4. What is the package type of the MT41J128M16JT-125:K TR?

    The package type is 96-TFBGA (8mm x 14mm).

  5. Does the MT41J128M16JT-125:K TR support on-die termination?

    Yes, it supports on-die termination (ODT) for data, strobe, and mask signals.

  6. What are the operating temperature ranges for the MT41J128M16JT-125:K TR?

    The operating temperature ranges from 0°C to 95°C.

  7. Does the MT41J128M16JT-125:K TR have an integrated thermal sensor?

    Yes, it features an integrated thermal sensor to optimize system performance and reliability.

  8. What are some of the advanced features supported by the MT41J128M16JT-125:K TR?

    It supports write leveling, dynamic power management, programmable CAS latencies, and self refresh modes.

  9. Is the MT41J128M16JT-125:K TR RoHS compliant?

    Yes, it is RoHS compliant according to EU regulations 2011/65/EU and 2015/863/EU.

  10. What are some typical applications for the MT41J128M16JT-125:K TR?

    Typical applications include networking equipment, storage systems, industrial automation, and high-performance computing.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - DDR3
Memory Size:2Gb (128M x 16)
Memory Interface:Parallel
Clock Frequency:800 MHz
Write Cycle Time - Word, Page:- 
Access Time:13.75 ns
Voltage - Supply:1.425V ~ 1.575V
Operating Temperature:0°C ~ 95°C (TC)
Mounting Type:Surface Mount
Package / Case:96-TFBGA
Supplier Device Package:96-FBGA (8x14)
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Similar Products

Part Number MT41J128M16JT-125:K TR MT41K128M16JT-125:K TR
Manufacturer Micron Technology Inc. Micron Technology Inc.
Product Status Active Active
Memory Type Volatile Volatile
Memory Format DRAM DRAM
Technology SDRAM - DDR3 SDRAM - DDR3L
Memory Size 2Gb (128M x 16) 2Gb (128M x 16)
Memory Interface Parallel Parallel
Clock Frequency 800 MHz 800 MHz
Write Cycle Time - Word, Page - -
Access Time 13.75 ns 13.75 ns
Voltage - Supply 1.425V ~ 1.575V 1.283V ~ 1.45V
Operating Temperature 0°C ~ 95°C (TC) 0°C ~ 95°C (TC)
Mounting Type Surface Mount Surface Mount
Package / Case 96-TFBGA 96-TFBGA
Supplier Device Package 96-FBGA (8x14) 96-FBGA (8x14)

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