MT47H32M16NF-25E:H TR
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Micron Technology Inc. MT47H32M16NF-25E:H TR

Manufacturer No:
MT47H32M16NF-25E:H TR
Manufacturer:
Micron Technology Inc.
Package:
Tape & Reel (TR)
Description:
IC DRAM 512MBIT PARALLEL 84FBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MT47H32M16NF-25E:H TR is a DDR2 SDRAM module manufactured by Micron Technology Inc. This component is part of the DDR2 SDRAM family, known for its high-speed double data rate architecture. The 'IT' in the part number indicates that it is designed for industrial temperature operation, making it suitable for a wide range of environments. The 'H' revision and 'TR' designation signify that this is the tape and reel version, packaged in reels of 2000 units. This module is particularly useful in applications requiring high memory bandwidth and reliability.

Key Specifications

Parameter Value
Technology DDR2 SDRAM
Density 512 Mb
Depth 32 Mb
Width x16
Voltage 1.8 V
Package 84-ball FBGA
Pin Count 84
Clock Rate 400 MHz
Data Rate DDR2-800
Cycle Time 2.5 ns
Operating Temperature (C) -40 to +95
CAS Latency (CL) CL = 5

Key Features

  • High-Speed Operation: The MT47H32M16NF-25E:H TR operates at a clock rate of 400 MHz and supports a data rate of DDR2-800, making it suitable for high-performance applications.
  • Industrial Temperature Range: Designed to operate in a wide temperature range of -40°C to +95°C, this module is ideal for industrial and automotive applications.
  • Programmable Burst Lengths: Supports burst lengths of 4 or 8, providing flexibility in data transfer operations.
  • Power-Saving Modes: Features self-refresh, power-save, and power-down modes to reduce power consumption during idle periods.
  • On-Die Termination (ODT): Includes on-die termination to improve signal integrity and reduce noise.
  • RoHS Compliance: Compliant with the Restriction of Hazardous Substances (RoHS) directive, ensuring environmental sustainability.

Applications

  • Industrial Automation: Suitable for use in industrial control systems, robotics, and other automation equipment due to its industrial temperature range and high reliability.
  • Automotive Systems: Meets the AEC-Q100 standard, making it suitable for use in automotive electronics such as infotainment systems, navigation, and safety systems.
  • Embedded Systems: Ideal for embedded systems requiring high memory bandwidth and low power consumption, such as in medical devices, aerospace, and defense applications.
  • Server and Storage Systems: Can be used in server and storage systems where high-speed memory is crucial for performance.

Q & A

  1. What is the technology used in the MT47H32M16NF-25E:H TR?

    The MT47H32M16NF-25E:H TR uses DDR2 SDRAM technology.

  2. What is the memory density of this module?

    The memory density is 512 Mb.

  3. What is the operating voltage of this module?

    The operating voltage is 1.8 V.

  4. What is the package type and pin count of this module?

    The package type is 84-ball FBGA.

  5. What are the supported data rates for this module?

    The module supports a data rate of DDR2-800.

  6. What is the CAS latency (CL) of this module?

    The CAS latency (CL) is 5.

  7. Is this module RoHS compliant?

    Yes, the module is RoHS compliant.

  8. What are the power-saving features of this module?

    The module features self-refresh, power-save, and power-down modes.

  9. What are the supported burst lengths for this module?

    The module supports burst lengths of 4 or 8.

  10. What is the operating temperature range of this module?

    The operating temperature range is -40°C to +95°C.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - DDR2
Memory Size:512Mb (32M x 16)
Memory Interface:Parallel
Clock Frequency:400 MHz
Write Cycle Time - Word, Page:15ns
Access Time:400 ps
Voltage - Supply:1.7V ~ 1.9V
Operating Temperature:0°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:84-TFBGA
Supplier Device Package:84-FBGA (8x12.5)
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