MT47H256M8EB-25E:C
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Micron Technology Inc. MT47H256M8EB-25E:C

Manufacturer No:
MT47H256M8EB-25E:C
Manufacturer:
Micron Technology Inc.
Package:
Tray
Description:
IC DRAM 2GBIT PARALLEL 60FBGA
Delivery:
Payment:
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Product Introduction

Overview

The MT47H256M8EB-25E:C is a DDR2 SDRAM memory module produced by Micron Technology Inc. This component is designed to provide high-performance memory solutions for a variety of applications. It features a 2 Gbit capacity, organized as 256M x 8 bits, and operates at a clock speed of 400 MHz. The module is built using CMOS technology and is housed in a 60-ball PBGA package, ensuring reliable and efficient operation over a temperature range of 0°C to 85°C.

Key Specifications

SpecificationValue
Part NumberMT47H256M8EB-25E:C
ManufacturerMicron Technology Inc.
Memory TypeDDR2 SDRAM
Capacity2 Gbit (256M x 8 bits)
Clock Speed400 MHz
Access Time0.4 ns
Package Type60-ball PBGA
Operating Temperature0°C to 85°C
TechnologyCMOS

Key Features

  • High-speed operation at 400 MHz clock speed.
  • Low latency with an access time of 0.4 ns.
  • Reliable operation over a wide temperature range (0°C to 85°C).
  • Compact 60-ball PBGA package for efficient board design.
  • CMOS technology for low power consumption.

Applications

The MT47H256M8EB-25E:C DDR2 SDRAM is suitable for a wide range of applications, including:

  • Embedded systems requiring high-performance memory.
  • Industrial control systems.
  • Networking equipment.
  • Consumer electronics such as set-top boxes and gaming consoles.
  • Automotive systems.

Q & A

  1. What is the part number of this DDR2 SDRAM module?
    The part number is MT47H256M8EB-25E:C.
  2. Who is the manufacturer of this component?
    The manufacturer is Micron Technology Inc.
  3. What is the capacity of this memory module?
    The capacity is 2 Gbit, organized as 256M x 8 bits.
  4. What is the clock speed of this DDR2 SDRAM?
    The clock speed is 400 MHz.
  5. What is the access time of this memory module?
    The access time is 0.4 ns.
  6. In what package type is this component housed?
    The component is housed in a 60-ball PBGA package.
  7. What is the operating temperature range of this component?
    The operating temperature range is 0°C to 85°C.
  8. What technology is used in this DDR2 SDRAM?
    The technology used is CMOS.
  9. What are some common applications for this memory module?
    Common applications include embedded systems, industrial control systems, networking equipment, consumer electronics, and automotive systems.
  10. Is this component suitable for high-temperature environments?
    Yes, it operates reliably over a temperature range of 0°C to 85°C.

Product Attributes

Memory Type:Volatile
Memory Format:DRAM
Technology:SDRAM - DDR2
Memory Size:2Gb (256M x 8)
Memory Interface:Parallel
Clock Frequency:400 MHz
Write Cycle Time - Word, Page:15ns
Access Time:400 ps
Voltage - Supply:1.7V ~ 1.9V
Operating Temperature:0°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:60-TFBGA
Supplier Device Package:60-FBGA (9x11.5)
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