Overview
The MT41K128M16JT-125 XIT:K is a DDR3L SDRAM (Synchronous Dynamic Random Access Memory) chip manufactured by Micron Technology Inc. This component is designed to provide high-performance memory solutions for a variety of applications. It operates at a low voltage of 1.35V, making it energy-efficient and suitable for systems requiring reduced power consumption.
This DRAM chip features a 128M x 16 memory configuration, offering a total capacity of 2Gbits. It is packaged in a 96-pin Fine-Pitch Ball Grid Array (FBGA) and supports a clock frequency of 800 MHz. The device is backward-compatible with DDR3 SDRAM, allowing for flexibility in system design.
Key Specifications
Attribute | Value |
---|---|
Manufacturer | Micron Technology Inc. |
Part Number | MT41K128M16JT-125 XIT:K |
Memory Type | DDR3L SDRAM |
Memory Density | 2Gbit |
Memory Configuration | 128M x 16 |
Package Type | 96-Pin FBGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C to 95°C |
Supply Voltage | 1.283V to 1.45V |
Clock Frequency | 800 MHz |
Access Time | 13.75 ns |
Refresh Count | 8192-cycle refresh |
RoHS Compliance | Yes |
Key Features
- Low Voltage Operation: Operates at 1.35V, reducing power consumption and heat generation.
- High Performance: Supports a clock frequency of 800 MHz, ensuring high-speed data transfer.
- Backward Compatibility: Compatible with DDR3 SDRAM, allowing for easy integration into existing systems.
- Automatic Self Refresh: Features automatic self-refresh modes to reduce power consumption during idle periods.
- Programmable CAS Latency: Supports programmable CAS (READ) latency, allowing for optimized system performance.
- Differential Clock Inputs: Uses differential clock inputs (CK, CK#) for improved signal integrity.
- On-Die Termination (ODT): Includes nominal and dynamic on-die termination for better signal quality.
Applications
The MT41K128M16JT-125 XIT:K is suitable for a wide range of applications, including:
- Server and Data Center Systems: High-performance memory for server and data center applications requiring low power and high reliability.
- Embedded Systems: Ideal for embedded systems that need high-speed memory with low power consumption.
- Industrial Automation: Used in industrial automation systems that require robust and reliable memory solutions.
- Consumer Electronics: Suitable for consumer electronics such as gaming consoles, set-top boxes, and other high-performance devices.
Q & A
- What is the memory configuration of the MT41K128M16JT-125 XIT:K?
The memory configuration is 128M x 16, providing a total capacity of 2Gbits.
- What is the operating voltage of this DRAM chip?
The operating voltage is 1.35V, with a range of 1.283V to 1.45V.
- What is the clock frequency supported by this chip?
The clock frequency is 800 MHz.
- Is the MT41K128M16JT-125 XIT:K backward-compatible with DDR3 SDRAM?
Yes, it is backward-compatible with DDR3 SDRAM.
- What is the package type of this component?
The package type is a 96-Pin Fine-Pitch Ball Grid Array (FBGA).
- What are the operating temperature ranges for this DRAM chip?
The operating temperature range is -40°C to 95°C.
- Does the MT41K128M16JT-125 XIT:K support automatic self-refresh?
Yes, it supports automatic self-refresh modes.
- What is the access time of this DRAM chip?
The access time is 13.75 ns.
- Is the MT41K128M16JT-125 XIT:K RoHS compliant?
Yes, it is RoHS compliant.
- What are some common applications for this DRAM chip?
Common applications include server and data center systems, embedded systems, industrial automation, and consumer electronics.