MT29F512G08CMCEBJ4-37ITRES:E TR
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Micron Technology Inc. MT29F512G08CMCEBJ4-37ITRES:E TR

Manufacturer No:
MT29F512G08CMCEBJ4-37ITRES:E TR
Manufacturer:
Micron Technology Inc.
Package:
Tape & Reel (TR)
Description:
IC MLC 256G 32GX8 VBGA 132VBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MT29F512G08CMCEBJ4-37ITRES:E TR is a Multi-Level Cell (MLC) NAND flash memory component produced by Micron Technology Inc. This memory device is part of Micron's NAND flash family, designed to provide high-density storage solutions for various applications. Although it is listed as an obsolete part, it remains relevant for historical and legacy system support.

Key Specifications

SpecificationValue
Memory Size512 Gbit
Memory Organization64G x 8
Memory InterfaceParallel
Package Type132-Pin VBGA
Clock FrequencyNot specified (refer to datasheet for detailed timing)

Key Features

  • High-density storage: Offers 512 Gbit of storage capacity, making it suitable for applications requiring large data storage.
  • MLC NAND technology: Provides a balance between performance and cost, making it a viable option for various storage needs.
  • Parallel interface: Supports high-speed data transfer through a parallel interface.
  • Compact packaging: The 132-Pin VBGA package is designed for space-efficient integration into systems.

Applications

The MT29F512G08CMCEBJ4-37ITRES:E TR is suitable for a variety of applications, including:

  • Embedded systems: Such as industrial control systems, medical devices, and automotive systems.
  • Consumer electronics: Like set-top boxes, digital TVs, and gaming consoles.
  • Storage solutions: For solid-state drives (SSDs), USB drives, and other flash-based storage devices.

Q & A

  1. What is the memory size of the MT29F512G08CMCEBJ4-37ITRES:E TR?
    The memory size is 512 Gbit.
  2. What type of NAND technology does this component use?
    It uses Multi-Level Cell (MLC) NAND technology.
  3. What is the memory organization of this component?
    The memory organization is 64G x 8.
  4. What type of interface does this component use?
    It uses a parallel interface.
  5. What is the package type of this component?
    The package type is 132-Pin VBGA.
  6. Is this component still in production?
    No, it is listed as an obsolete part.
  7. What are some common applications for this component?
    It is used in embedded systems, consumer electronics, and storage solutions.
  8. Why is MLC NAND preferred in some applications?
    MLC NAND is preferred for its balance between performance and cost.
  9. How does the parallel interface benefit this component?
    The parallel interface supports high-speed data transfer.
  10. What is the significance of the 132-Pin VBGA package?
    The 132-Pin VBGA package is designed for space-efficient integration into systems.

Product Attributes

Memory Type:Non-Volatile
Memory Format:Flash
Technology:FLASH - NAND (MLC)
Memory Size:512Gb (64G x 8)
Memory Interface:Parallel
Clock Frequency:267 MHz
Write Cycle Time - Word, Page:- 
Access Time:- 
Voltage - Supply:2.7V ~ 3.6V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:132-VBGA
Supplier Device Package:132-VBGA (12x18)
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