Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	1108883-05 SERIES 0517 PIN-LINE VERTISOCKET Aries Electronics	583	$0.00			-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	181-PGM18041-10 CONN SOCKET PGA GOLD Aries Electronics	322	$0.00		PGM	Bulk	Obsolete	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	192-PG17043-10H CONN SOCKET PGA GOLD Aries Electronics	185	$0.00		PG	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	233-PGM18039-51 CONN SOCKET PGA GOLD Aries Electronics	524	$0.00		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	256-PG16001-10H CONN SOCKET PGA GOLD Aries Electronics	407	$0.00		PG	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	257-PGM20012-10 CONN SOCKET PGA GOLD Aries Electronics	536	$0.00		PGM	Bulk	Obsolete	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	1109800-14 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	432	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109800-16 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	308	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109800-18 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	83	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109800-20 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	511	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109800-28 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	486	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109800-10 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	341	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109800-12 CONN IC DIP SOCKET 12POS GOLD Aries Electronics	228	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109800-22 CONN IC DIP SOCKET 22POS GOLD Aries Electronics	569	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109800-24 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	278	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109800-26 CONN IC DIP SOCKET 26POS GOLD Aries Electronics	75	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	26 (2 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109800-8 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	46	$0.00		Correct-A-Chip® 1109800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Programmable	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109681-308 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	115	$0.00			Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109681-314 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	475	$0.00			Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109681-316 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	112	$0.00			Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Spacer	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-