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Mfr Part #
Quantity Available
UnitPrice
RFQ
Series
Packaging
Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
90
$0.00
SIP050-1x
Bulk
Obsolete SIP 23 (1 x 23) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
468
$0.00
SIP050-1x
Bulk
Obsolete SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
203
$0.00
SIP050-1x
Bulk
Obsolete SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
155
$0.00
SIP050-1x
Bulk
Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
434
$0.00
SIP050-1x
Bulk
Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
164
$0.00
SIP050-1x
Bulk
Obsolete SIP 24 (1 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
326
$0.00
SIP050-1x
Bulk
Obsolete SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
426
$0.00
SIP050-1x
Bulk
Obsolete SIP 26 (1 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
286
$0.00
SIP050-1x
Bulk
Obsolete SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
307
$0.00
SIP050-1x
Bulk
Obsolete SIP 31 (1 x 31) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
180
$0.00
SIP050-1x
Bulk
Obsolete SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
570
$0.00
SIP1x
Bulk
Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
128
$0.00
DPF3
Bag
Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
219
$0.00
DPF3
Bag
Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
515
$0.00
DPF3
Bag
Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
527
$0.00
SIP1x
Bulk
Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
488
$0.00
Tray
Obsolete LGA 771 (33 x 33) 0.043" (1.09mm) Gold - Copper Alloy Surface Mount Open Frame Solder 0.043" (1.09mm) - - - Thermoplastic -25°C ~ 100°C
241
$0.00
Tray
Obsolete PGA, ZIF (ZIP) 939 (31 x 31) 0.050" (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -
5
$38.52
Bulk
Obsolete LGA 1207 (33 x 34) 0.043" (1.09mm) Gold - Copper Alloy Surface Mount Closed Frame Solder 0.043" (1.09mm) Gold - Copper Alloy Thermoplastic -
284
$0.00
Tray
Active PGA 940 (30 x 30) 0.050" (1.27mm) Gold 30.0µin (0.76µm) - Surface Mount Closed Frame - - - - - - -