Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	643654-1 CONN SOCKET SIP 22POS TIN TE Connectivity AMP Connectors	313	$0.00		Diplomate DL	Tray	Active	SIP	22 (1 x 22)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 105°C
	643662-1 CONN SOCKET SIP 30POS TIN TE Connectivity AMP Connectors	276	$2.79		Diplomate DL	Tray	Obsolete	SIP	30 (1 x 30)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 105°C
	822473-4 CONN SOCKET PLCC 44POS TIN-LEAD TE Connectivity AMP Connectors	228	$0.00			Tube	Obsolete	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin-Lead	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	Thermoplastic	-
	232-1297-00-3303 CONN IC DIP SOCKET ZIF 32POS GLD 3M	524	$0.00		OEM	Tube	Obsolete	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	250.0µin (6.35µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	250.0µin (6.35µm)	Beryllium Copper	Polyether Imide (PEI), Glass Filled	-55°C ~ 105°C
	22-16-4 CONN TRANSIST TO-5 4POS GOLD Grayhill Inc.	3	$3.37		22	Bulk	Obsolete	Transistor, TO-5	4 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Thermoplastic, Glass Filled	-
	60-1518-10 CONN IC DIP SOCKET 60POS GOLD Aries Electronics	241	$0.00		518	Bulk	Obsolete	DIP, 0.2" (5.08mm) Row Spacing	60 (2 x 30)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	390261-3 CONN IC DIP SOCKET 14POS TINLEAD TE Connectivity AMP Connectors	178	$0.00			Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	-	-40°C ~ 105°C
	390262-2 CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors	522	$0.00			Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole, Right Angle, Vertical	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	-	-40°C ~ 105°C
	822473-3 CONN SOCKET PLCC 32POS TIN-LEAD TE Connectivity AMP Connectors	428	$0.00			Tube	Obsolete	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin-Lead	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	Thermoplastic	-
	822472-7 CONN SOCKET PLCC 84POS TIN-LEAD TE Connectivity AMP Connectors	351	$0.00			Tube	Obsolete	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin-Lead	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin-Lead	-	Phosphor Bronze	Thermoplastic	-
	822499-1 CONN SOCKET PLCC 44POS TIN-LEAD TE Connectivity AMP Connectors	340	$0.00			Tube	Obsolete	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin-Lead	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin-Lead	-	Phosphor Bronze	Thermoplastic	-
	6-513-10 CONN SOCKET SIP 6POS GOLD Aries Electronics	208	$0.00		0513	Bulk	Obsolete	SIP	6 (1 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	390261-2 CONN IC DIP SOCKET 8POS TIN-LEAD TE Connectivity AMP Connectors	212	$0.00			Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	-	-40°C ~ 105°C
	390261-4 CONN IC DIP SOCKET 16POS TINLEAD TE Connectivity AMP Connectors	267	$0.00			Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	-	-40°C ~ 105°C
	916788-1 CONN SOCKET PGA ZIF 462POS TIN TE Connectivity AMP Connectors	73	$0.00			Tray	Obsolete	PGA, ZIF (ZIP)	462 (19 x 19)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-
	101-93-306-41-560000 CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp.	96	$0.00		101	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	101-93-308-41-560000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	489	$0.00		101	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	101-93-314-41-560000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	542	$0.00		101	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	101-93-316-41-560000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	413	$0.00		101	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	101-93-318-41-560000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	489	$0.00		101	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C