Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	44-3574-18 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	6	$160.43		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-3575-18 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	7	$161.51		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-6574-18 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	4	$162.38		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-6575-18 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	3	$159.29		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	2289-9022-00-2401 3M TEXTOOL 2289-9022-00-2401 .80 3M	6	$164.37			Bulk	Obsolete	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	40-3574-18 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	4	$165.41		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	40-6574-18 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	6	$166.02		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	40-3575-18 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	7	$165.82		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	40-6575-18 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	4	$166.70		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	2324-9021-02-2421 3M TEXTOOL TEST & BURN-IN BALL G 3M	4	$165.26			Bulk	Obsolete	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	79300-17-004 3M TEXTOOL 79300-17-004=PP17-015 3M	3	$165.85			Bulk	Obsolete	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	2176-9028-05-2501 3M TEXTOOL TEST & BURN-IN BALL G 3M	7	$166.53			Bulk	Obsolete	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	48-3551-18 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	3	$168.33		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled	-55°C ~ 250°C
	48-3552-18 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	3	$167.53		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled	-55°C ~ 250°C
	48-3553-18 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	5	$169.12		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled	-55°C ~ 250°C
	48-6552-18 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	6	$165.76		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled	-55°C ~ 250°C
	48-6553-18 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	7	$168.99		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled	-55°C ~ 250°C
	48-3554-18 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	6	$169.08		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled	-55°C ~ 250°C
	48-6554-18 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	2	$167.17		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled	-55°C ~ 250°C
	48-3574-18 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	5	$174.82		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-