Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	550-10-652M35-001152 BGA SOLDER TAIL Preci-Dip	11	$76.46		550	Bulk	Active	BGA	652 (35 x 35)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	68-PRS11033-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	8	$73.02		PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
	68-PLS11033-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	6	$72.51		PLS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
	69-PLS11031-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	7	$73.21		PLS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
	69-PLS13112-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	4	$72.74		PLS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
	69-PRS11031-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	4	$72.14		PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
	69-PRS11055-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2	$74.02		PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
	69-PRS13112-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	9	$72.69		PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
	558-10-600M35-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	8	$76.17		558	Bulk	Active	BGA	600 (35 x 35)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	518-77-600M35-001105 CONN SOCKET PGA 600POS GOLD Preci-Dip	2	$76.30		518	Bulk	Active	PGA	600 (35 x 35)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	42-3551-16 CONN IC DIP SOCKET ZIF 42POS Aries Electronics	6	$73.37		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-3552-16 CONN IC DIP SOCKET ZIF 42POS Aries Electronics	6	$75.18		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-3553-16 CONN IC DIP SOCKET ZIF 42POS Aries Electronics	8	$74.20		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-6551-16 CONN IC DIP SOCKET ZIF 42POS Aries Electronics	6	$73.17		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-6552-16 CONN IC DIP SOCKET ZIF 42POS Aries Electronics	7	$73.83		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-6553-16 CONN IC DIP SOCKET ZIF 42POS Aries Electronics	3	$75.19		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-3554-16 CONN IC DIP SOCKET ZIF 42POS Aries Electronics	14	$74.79		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-6554-16 CONN IC DIP SOCKET ZIF 42POS Aries Electronics	4	$75.32		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	175-PGM16003-11 CONN SOCKET PGA GOLD Aries Electronics	9	$75.37		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	80-PRS13127-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	4	$74.83		PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C