Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	558-10-560M33-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	8	$66.35		558	Bulk	Active	PGA	560 (33 x 33)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	20-PLS13120-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	10	$64.81		PLS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
	20-PRS13120-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3	$64.03		PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
	36-3551-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	3	$65.16		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-3553-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	4	$64.80		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-6551-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	8	$64.99		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-6552-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	4	$64.01		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-6553-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	9	$65.35		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled	-55°C ~ 250°C
	36-3552-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	8	$64.20		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-3554-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	9	$63.82		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-6554-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	14	$64.84		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	514-83-600M35-001148 CONN SOCKET BGA 600POS GOLD Preci-Dip	9	$66.92		514	Bulk	Active	BGA	600 (35 x 35)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	24-3518-11H CONN IC DIP SOCKET 24POS GOLD Aries Electronics	11	$65.46		518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	1109042 537 ZIF TEST SCKT LIVE BUG TYPE Aries Electronics	15	$65.32			-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	1109043 538 ZIF TEST SCKT LIVE BUG TYPE Aries Electronics	15	$64.97			-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	518-77-520M31-001106 CONN SOCKET PGA 520POS GOLD Preci-Dip	10	$67.09		518	Bulk	Active	PGA	520 (31 x 31)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	44-6556-41 CONN IC DIP SOCKET 44POS GOLD Aries Electronics	7	$65.38		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	550-10-600M35-001152 BGA SOLDER TAIL Preci-Dip	10	$68.03		550	Bulk	Active	BGA	600 (35 x 35)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	510-13-299-20-096003 PIN GRID ARRAY SOCKETS Mill-Max Manufacturing Corp.	2	$66.27		510	Tube	Active	PGA	299 (20 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-13-299-20-096001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	13	$65.06		510	Bulk	Active	PGA	299 (20 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C