Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	550-10-520M31-001152 BGA SOLDER TAIL Preci-Dip	15	$58.50		550	Bulk	Active	BGA	520 (31 x 31)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	546-83-559-22-131147 CONN SOCKET PGA 559POS GOLD Preci-Dip	6	$58.59		546	Bulk	Active	PGA	559 (22 x 22)	0.050" (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	169-PGM13001-51 CONN SOCKET PGA GOLD Aries Electronics	7	$57.51		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	550-80-361-18-101135 PGA SOLDER TAIL Preci-Dip	12	$59.24		550	Bulk	Active	PGA	361 (18 x 18)	0.050" (1.27mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	518-77-456M26-001106 CONN SOCKET PGA 456POS GOLD Preci-Dip	10	$59.13		518	Bulk	Active	PGA	456 (26 x 26)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	32-3551-16 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	12	$57.65		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-3552-16 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	17	$57.08		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-3553-16 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	3	$57.74		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-6551-16 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	4	$57.90		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-6552-16 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	15	$56.92		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-6553-16 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	12	$57.70		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled	-55°C ~ 250°C
	32-3554-16 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	12	$56.83		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	558-10-500M30-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	14	$60.39		558	Bulk	Active	PGA	500 (30 x 30)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	44-3570-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	5	$57.06		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-3571-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	11	$58.24		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-3572-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	9	$58.21		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-3574-16 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	8	$57.66		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-3575-16 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	9	$58.07		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-6570-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	12	$58.33		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-6571-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	7	$57.90		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled	-