Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	510-93-175-16-006003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	7	$35.09		510	Bulk	Active	PGA	175 (16 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	550-80-381-18-101135 PGA SOLDER TAIL Preci-Dip	23	$35.68		550	Bulk	Active	PGA	381 (18 x 18)	0.050" (1.27mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	510-43-176-15-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	6	$35.17		510	Bulk	Active	PGA	176 (15 x 15)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-176-15-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	23	$35.44		510	Bulk	Active	PGA	176 (15 x 15)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-176-15-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	18	$35.50		510	Bulk	Active	PGA	176 (15 x 15)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	1437522-4 CONN SOCKET PGA 321POS GOLD TE Connectivity AMP Connectors	26	$35.40			Bulk	Active	PGA	321 (19 x 19)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Thermoplastic, Polyester	-55°C ~ 105°C
	40-6508-211 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	7	$35.36		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	40-6508-311 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	23	$34.82		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	517-83-599-54-131111 CONN SOCKET PGA 599POS GOLD Preci-Dip	2	$36.96		517	Bulk	Active	PGA	599 (54 x 54)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	133-PGM14014-40 CONN SOCKET PGA GOLD Aries Electronics	5	$35.54		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	133-PGM14014-50 CONN SOCKET PGA GOLD Aries Electronics	3	$34.84		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	510-43-177-15-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	6	$35.09		510	Bulk	Active	PGA	177 (15 x 15)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	546-87-419-19-111147 CONN SOCKET PGA 419POS GOLD Preci-Dip	7	$36.70		546	Bulk	Active	PGA	419 (19 x 19)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	42-3570-11 CONN IC DIP SOCKET ZIF 42POS GLD Aries Electronics	21	$35.11		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-3571-11 CONN IC DIP SOCKET ZIF 42POS GLD Aries Electronics	12	$35.08		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-3572-11 CONN IC DIP SOCKET ZIF 42POS GLD Aries Electronics	24	$35.84		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-3573-11 CONN IC DIP SOCKET ZIF 42POS GLD Aries Electronics	9	$35.45		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-3574-11 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	3	$35.20		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-3575-11 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	12	$35.06		57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	42-6570-11 CONN IC DIP SOCKET ZIF 42POS GLD Aries Electronics	21	$35.87		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-