Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	514-87-352M26-001148 CONN SOCKET BGA 352POS GOLD Preci-Dip	18	$32.14		514	Bulk	Active	BGA	352 (26 x 26)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	40-3503-21 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	26	$31.63		503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	40-3503-31 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	22	$31.14		503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	510-93-136-14-051001 SOCKET SOLDERTAIL 136-PGA Mill-Max Manufacturing Corp.	17	$31.25		510	Bulk	Active	PGA	136 (14 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-136-14-051002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	17	$30.77		510	Bulk	Active	PGA	136 (14 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-136-14-051003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	6	$31.21		510	Bulk	Active	PGA	136 (14 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	40-6503-21 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2	$31.64		503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	40-6503-31 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	11	$30.91		503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	510-41-176-15-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	10	$30.97		510	Bulk	Active	PGA	176 (15 x 15)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	546-87-391-18-101147 CONN SOCKET PGA 391POS GOLD Preci-Dip	12	$32.26		546	Bulk	Active	PGA	391 (18 x 18)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	510-91-176-15-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	7	$31.53		510	Bulk	Active	PGA	176 (15 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-176-15-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	5	$31.64		510	Bulk	Active	PGA	176 (15 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	558-10-256M16-000104 BGA SURFACE MOUNT 1.27MM Preci-Dip	15	$32.99		558	Bulk	Active	BGA	256 (16 x 16)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	558-10-256M20-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	18	$32.37		558	Bulk	Active	BGA	256 (20 x 20)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	518-77-255M16-001105 CONN SOCKET PGA 255POS GOLD Preci-Dip	12	$32.75		518	Bulk	Active	PGA	255 (16 x 16)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	558-10-272M20-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	21	$32.63		558	Bulk	Active	PGA	272 (20 x 20)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	510-41-177-15-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	30	$31.30		510	Bulk	Active	PGA	177 (15 x 15)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-177-15-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	12	$31.07		510	Bulk	Active	PGA	177 (15 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-177-15-061002 SOCKET SOLDERTAIL 177-PGA Mill-Max Manufacturing Corp.	6	$31.62		510	Bulk	Active	PGA	177 (15 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-177-15-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2	$31.74		510	Bulk	Active	PGA	177 (15 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C