Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	510-41-145-15-081001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	7	$28.90		510	Bulk	Active	PGA	145 (15 x 15)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-145-13-041002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	32	$29.12		510	Bulk	Active	PGA	145 (13 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-145-13-041003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	10	$28.85		510	Bulk	Active	PGA	145 (13 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-145-15-002002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3	$28.87		510	Bulk	Active	PGA	145 (15 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-145-15-002003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	9	$28.96		510	Bulk	Active	PGA	145 (15 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-145-17-001002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	24	$28.79		510	Bulk	Active	PGA	145 (17 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-145-17-001003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	20	$29.10		510	Bulk	Active	PGA	145 (17 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-964-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$28.66			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-964-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	8	$28.57			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	32-6508-211 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	19	$29.19		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	32-6508-311 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	8	$28.55		508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	36-6556-31 CONN IC DIP SOCKET 36POS GOLD Aries Electronics	4	$29.29		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-6556-21 CONN IC DIP SOCKET 36POS GOLD Aries Electronics	18	$28.58		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	510-93-049-07-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	15	$28.94		510	Tube	Active	DIP, 0.1" (2.54mm) Row Spacing	49 (7 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-950-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$29.17			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-950-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	29	$29.06			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	614-87-279-19-081112 CONN SOCKET PGA 279POS GOLD Preci-Dip	27	$30.12		614	Bulk	Active	PGA	279 (19 x 19)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	546-87-364-17-091147 CONN SOCKET PGA 364POS GOLD Preci-Dip	17	$29.91		546	Bulk	Active	PGA	364 (17 x 17)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	116-43-652-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	9	$29.11			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-652-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3	$29.09			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-