Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	510-93-100-13-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	25	$27.55		510	Bulk	Active	PGA	100 (13 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-100-13-062003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	6	$27.78		510	Bulk	Active	PGA	100 (13 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	48-81000-610C CONN IC DIP SOCKET 48POS GOLD Aries Electronics	14	$27.68		8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	48-81250-610C CONN IC DIP SOCKET 48POS GOLD Aries Electronics	25	$27.84		8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	550-10-256M16-000152 BGA SOLDER TAIL Preci-Dip	16	$28.90		550	Bulk	Active	BGA	256 (16 x 16)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	550-10-256M20-001152 BGA SOLDER TAIL Preci-Dip	8	$29.42		550	Bulk	Active	BGA	256 (20 x 20)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
	116-43-950-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	24	$27.80			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-950-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	13	$28.13			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	517-83-475-21-121111 CONN SOCKET PGA 475POS GOLD Preci-Dip	27	$28.69		517	Bulk	Active	PGA	475 (21 x 21)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	110-43-640-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	11	$27.59			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-640-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	16	$27.81			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	510-41-132-13-041001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	22	$28.22		510	Bulk	Active	PGA	132 (13 x 13)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-41-132-14-071001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	13	$28.01		510	Bulk	Active	PGA	132 (14 x 14)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	36-6503-21 CONN IC DIP SOCKET 36POS GOLD Aries Electronics	25	$28.09		503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	36-6503-31 CONN IC DIP SOCKET 36POS GOLD Aries Electronics	26	$28.08		503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	510-93-088-12-052001 SOCKET SOLDERTAIL 88-PGA Mill-Max Manufacturing Corp.	4	$28.04		510	Bulk	Active	PGA	88 (12 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-43-101-13-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	15	$28.29		510	Bulk	Active	PGA	101 (13 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-088-12-052002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	25	$27.92		510	Bulk	Active	PGA	88 (12 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-088-12-052003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	35	$27.91		510	Bulk	Active	PGA	88 (12 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-93-088-13-062002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	5	$27.56		510	Bulk	Active	PGA	88 (13 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C