Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	36-3551-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	36	$25.66		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-3553-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	24	$26.05		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-6551-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	6	$26.11		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-6552-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	3	$26.19		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-6553-11 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	22	$25.52		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-3552-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	5	$25.51		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-3554-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	37	$25.74		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	36-6554-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	33	$25.68		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	116-43-652-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	16	$25.52			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-652-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	33	$25.51			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	32-6556-21 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	15	$26.21		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	32-6556-31 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	4	$26.17		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	123-13-952-41-001000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	13	$25.82		123	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	546-87-325-18-111147 CONN SOCKET PGA 325POS GOLD Preci-Dip	9	$27.14		546	Bulk	Active	PGA	325 (18 x 18)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	36-0508-21 CONN SOCKET SIP 36POS GOLD Aries Electronics	14	$25.77		508	Bulk	Active	SIP	36 (1 x 36)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	36-0508-31 CONN SOCKET SIP 36POS GOLD Aries Electronics	22	$26.15		508	Bulk	Active	SIP	36 (1 x 36)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	36-1508-21 CONN IC DIP SOCKET 36POS GOLD Aries Electronics	17	$25.79		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	36-1508-31 CONN IC DIP SOCKET 36POS GOLD Aries Electronics	39	$25.93		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	35-0511-11 CONN SOCKET SIP 35POS GOLD Aries Electronics	36	$25.72		511	Bulk	Active	SIP	35 (1 x 35)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	510-41-108-12-051001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	26	$25.97		510	Bulk	Active	PGA	108 (12 x 12)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C