Sockets for ICs, Transistors

Product List

21968 Items

Mfr Part #	Quantity Available	UnitPrice	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
116-87-310-41-006101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	361	$0.55	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-610-41-006101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	849	$0.55	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-83-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	355	$0.56	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
115-83-210-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	943	$0.56	115	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
115-83-310-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	627	$0.56	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
121-83-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	1,655	$0.56	121	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
917-87-104-41-005101 CONN TRANSIST TO-5 4POS GOLD Preci-Dip	1,109	$0.55	917	Bulk	Active	Transistor, TO-5	4 (Round)	-	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	-	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
917-87-104-41-053101 CONN TRANSIST TO-5 4POS GOLD Preci-Dip	938	$0.56	917	Bulk	Active	Transistor, TO-5	4 (Round)	-	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	-	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
122-83-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	799	$0.57	122	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
123-83-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	1,468	$0.56	123	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-83-610-41-005101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	1,350	$0.57	110	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-420-41-001101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	412	$0.58	110	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
02-0513-10H CONN SOCKET SIP 2POS GOLD Aries Electronics	927	$0.54	0513	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
04-0518-10 CONN SOCKET SIP 4POS GOLD Aries Electronics	1,142	$0.55	518	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
04-1518-10 CONN IC DIP SOCKET 4POS GOLD Aries Electronics	734	$0.55	518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
612-83-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	59	$0.57	612	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
03-0513-10T CONN SOCKET SIP 3POS GOLD Aries Electronics	1,746	$0.55	0513	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
03-0518-10H CONN SOCKET SIP 3POS GOLD Aries Electronics	313	$0.56	518	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
116-87-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	948	$0.57	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-87-314-41-117101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	1,592	$0.58	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C