Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	510-93-133-14-071001 CONN SOCKET PGA 133POS GOLD Mill-Max Manufacturing Corp.	45	$22.54		510	Tube	Active	PGA	133 (14 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-43-316-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	24	$21.96			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-316-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	28	$22.01			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-47-964-41-001000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	44	$22.19		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	546-83-223-18-091135 CONN SOCKET PGA 223POS GOLD Preci-Dip	36	$23.41		546	Bulk	Active	PGA	223 (18 x 18)	0.050" (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	546-83-223-18-091136 CONN SOCKET PGA 223POS GOLD Preci-Dip	36	$23.05		546	Bulk	Active	PGA	223 (18 x 18)	0.050" (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	116-43-324-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	10	$22.49			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-424-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	7	$22.22			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-624-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	28	$21.91			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-324-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	13	$22.57			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-424-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	33	$22.37			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-624-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	8	$22.13			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	1-1554653-1 CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors	12	$26.10			Tray	Last Time Buy	LGA	2011 (47 x 58)	-	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic	-
	24-3508-211 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	4	$22.47		508	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	24-3508-311 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	31	$22.07		508	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	127-93-668-41-002000 CONN IC DIP SOCKET 68POS GOLD Mill-Max Manufacturing Corp.	11	$22.56		127	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	68 (2 x 34)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070" (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	127-43-668-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2	$21.96		127	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	68 (2 x 34)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	28-3503-21 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	22	$22.40		503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	28-3503-31 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	31	$22.33		503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	326-93-164-41-001000 CONN SOCKET SIP 64POS GOLD Mill-Max Manufacturing Corp.	27	$22.53		326	Tube	Active	SIP	64 (1 x 64)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C