Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	123-43-952-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	37	$21.51		123	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-168-17-101002 SOCKET SOLDERTAIL 168-PGA Mill-Max Manufacturing Corp.	44	$21.75		510	Tube	Active	PGA	168 (17 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-41-168-17-101002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2	$21.80		510	Tube	Active	PGA	168 (17 x 17)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-43-428-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	34	$21.43			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	115-93-428-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$21.60			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-43-422-61-605000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$21.61			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-422-61-605000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	43	$21.53			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	30-1508-21 CONN IC DIP SOCKET 30POS GOLD Aries Electronics	43	$21.98		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	30-1508-31 CONN IC DIP SOCKET 30POS GOLD Aries Electronics	8	$21.95		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	48-6823-90T CONN IC DIP SOCKET 48POS TIN Aries Electronics	24	$21.94		Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
	1554653-1 CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors	16	$21.43			Tray	Last Time Buy	LGA	2011 (47 x 58)	-	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic	-25°C ~ 100°C
	126-93-648-41-003000 CONN IC DIP SOCKET 48POS GOLD Mill-Max Manufacturing Corp.	28	$21.62		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-43-648-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	5	$21.58		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	517-83-370-19-121111 CONN SOCKET PGA 370POS GOLD Preci-Dip	16	$22.93		517	Bulk	Active	PGA	370 (19 x 19)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	116-43-320-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	38	$21.86			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-43-420-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	10	$21.50			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-320-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	11	$22.01			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	116-93-420-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	25	$21.69			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	614-83-181-15-051112 CONN SOCKET PGA 181POS GOLD Preci-Dip	43	$22.56		614	Bulk	Active	PGA	181 (15 x 15)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	123-11-652-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	30	$21.66		123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C