Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	36-6575-10 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	39	$19.05		57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	126-93-648-41-001000 CONN IC DIP SOCKET 48POS GOLD Mill-Max Manufacturing Corp.	12	$18.84		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-43-648-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	28	$19.21		126	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	121-11-652-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	52	$18.94		121	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	44-3551-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	50	$19.03		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-3552-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	41	$18.95		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-3553-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	51	$19.11		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-6551-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	27	$19.20		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-6552-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	31	$19.13		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-6553-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	32	$19.09		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-3554-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	51	$19.16		55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	44-6554-10 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	49	$19.04		55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	44 (2 x 22)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
	612-13-636-41-001000 SOCKET CARRIER SLDRTL .600 36POS Mill-Max Manufacturing Corp.	45	$18.95		612	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	23-0508-21 CONN SOCKET SIP 23POS GOLD Aries Electronics	36	$18.89		508	Bulk	Active	SIP	23 (1 x 23)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	23-0508-31 CONN SOCKET SIP 23POS GOLD Aries Electronics	51	$19.04		508	Bulk	Active	SIP	23 (1 x 23)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	40-6556-11 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	9	$18.92		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	510-91-012-05-001001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	20	$18.72		510	Bulk	Active	PGA	12 (5 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-012-05-001002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	30	$18.74		510	Bulk	Active	PGA	12 (5 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-91-012-05-001003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	15	$18.71		510	Bulk	Active	PGA	12 (5 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-13-310-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	48	$19.09			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-