Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	116-43-964-41-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	7	$18.85		116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	175-PGM16010-10 CONN SOCKET PGA GOLD Aries Electronics	46	$18.66		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	510-11-068-11-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	4	$18.85		510	Tube	Active	PGA	68 (11 x 11)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	115-44-308-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$18.88			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	104-13-950-41-770000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	22	$18.67		104	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Thermoplastic	-
	124-93-636-41-002000 CONN IC DIP SOCKET 36POS GOLD Mill-Max Manufacturing Corp.	31	$18.51		124	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	124-43-636-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$19.05		124	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-43-210-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	48	$18.74			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	110-93-210-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	46	$18.66			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	210790-4 CONN SOCKET PGA 128POS GOLD TE Connectivity AMP Connectors	229	$0.00		STA	Bulk	Obsolete	PGA	128 (13 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin-Lead	118.1µin (3.00µm)	Phosphor Bronze	Thermoplastic, Polyester, Glass Filled	-
	24-C182-20 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	14	$18.93		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	24-C182-30 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	10	$18.87		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	24-C212-20 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	47	$18.70		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	24-C212-30 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	5	$18.89		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	24-C300-20 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	22	$18.90		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	24-C300-30 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	51	$19.06		EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	111-43-310-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	27	$18.70			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	111-93-310-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	43	$18.82			Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
	32-6556-11 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	26	$18.77		6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
	510-83-441-21-000101 CONN SOCKET PGA 441POS GOLD Preci-Dip	41	$19.51		510	Bulk	Active	PGA	441 (21 x 21)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C