Sockets for ICs, Transistors

Product List

21968 Items

Mfr Part #	Quantity Available	UnitPrice	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
NTE436W16 16-PIN DIP IC SOCKET NTE Electronics, Inc	40	$2.24		Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	-	-	-	-	Through Hole	-	Wire Wrap	-	-	-	-	-	-
ICA-632-SST CONN IC DIP SOCKET 32POS GOLD Samtec Inc.	16	$6.51	ICA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
D8864-42 CONN IC DIP SOCKET 64POS GOLD Harwin Inc.	96	$10.26	D8864	Tube	Active	DIP, 0.75" (19.05mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled	-55°C ~ 125°C
216-3340-00-0602J CONN IC DIP SOCKET ZIF 16POS GLD 3M	35	$22.50	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
110-87-304-41-005101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	3,864	$0.13	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
115-87-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	4,684	$0.14	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-87-304-41-117101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	2,157	$0.16	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-83-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	2,737	$0.19	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-304-41-105101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	4,714	$0.19	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-87-304-41-001101 CONN IC DIP SOCKET 321POS GOLD Preci-Dip	3,190	$0.19	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	321 (21 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
612-87-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	2,615	$0.20	612	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-306-41-005101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	1,957	$0.20	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-306-41-605101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	3,620	$0.20	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-304-41-006101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	1,195	$0.20	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-83-304-41-005101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	948	$0.21	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
115-83-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	2,639	$0.21	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
115-87-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	106	$0.22	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-304-41-018101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	1,364	$0.22	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-83-304-41-117101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	2,310	$0.22	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-87-304-31-012101 CONN IC DIP SOCKET 320POS GOLD Preci-Dip	961	$0.23	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	320 (19 x 19)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C