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My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
299-43-310-10-001000
299-43-310-10-001000
CONN IC DIP SOCKET 10POS GOLD
Mill-Max Manufacturing Corp.
 117 $4.52
299 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
ICA-640-STT
ICA-640-STT
CONN IC DIP SOCKET 40POS TIN
Samtec Inc.
 72 $5.17
ICA Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 105°C
840-AG11D-ESL-LF
840-AG11D-ESL-LF
CONN IC DIP SOCKET 40POS GOLD
TE Connectivity AMP Connectors
 50 $5.34
800 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)GoldFlashCopperPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 105°C
123-13-316-41-001000
123-13-316-41-001000
CONN IC DIP SOCKET 16POS GOLD
Mill-Max Manufacturing Corp.
 110 $5.93
123 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
XR2A-3201-N
XR2A-3201-N
CONN IC DIP SOCKET 32POS GOLD
Omron Electronics Inc-EMC Div
 26 $6.31
XR2 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
110-93-628-41-801000
110-93-628-41-801000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
 3 $7.09
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
XR2P2041
XR2P2041
CONN SOCKET SIP 20POS GOLD
Omron Electronics Inc-EMC Div
 97 $7.93
XR2 Bulk ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThreaded-Solder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
32-C182-10
32-C182-10
CONN IC DIP SOCKET 32POS GOLD
Aries Electronics
 85 $7.98
EJECT-A-DIP™ Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
10-2820-90T
10-2820-90T
CONN IC DIP SOCKET 10POS TIN
Aries Electronics
 104 $8.24
Vertisockets™ 800 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
10-2810-90T
10-2810-90T
CONN IC DIP SOCKET 10POS TIN
Aries Electronics
 25 $8.65
Vertisockets™ 800 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
10-2822-90
10-2822-90
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
 31 $9.37
Vertisockets™ 800 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
117-93-764-41-005000
117-93-764-41-005000
CONN IC DIP SOCKET 64POS GOLD
Mill-Max Manufacturing Corp.
 50 $9.59
117 Tube ActiveDIP, 0.75" (19.05mm) Row Spacing64 (2 x 32)0.070" (1.78mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleClosed FrameSolder0.070" (1.78mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-93-640-41-801000
110-93-640-41-801000
CONN IC DIP SOCKET 40POS GOLD
Mill-Max Manufacturing Corp.
 37 $11.10
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
12-6810-90C
12-6810-90C
CONN IC DIP SOCKET 12POS GOLD
Aries Electronics
 31 $12.68
Vertisockets™ 800 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing12 (2 x 6)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
APA-628-G-A1
APA-628-G-A1
ADAPTER PLUG
Samtec Inc.
 47 $14.45
APA Bulk Active-28 (2 x 14)0.100" (2.54mm)Gold20.0µin (0.51µm)Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Gold20.0µin (0.51µm)Phosphor BronzePolybutylene Terephthalate (PBT), Glass Filled-
28-823-90C
28-823-90C
CONN IC DIP SOCKET 28POS GOLD
Aries Electronics
 32 $15.65
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
24-6574-10
24-6574-10
CONN IC DIP SOCKET ZIF 24POS TIN
Aries Electronics
 12 $15.51
57 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
28-516-11
28-516-11
CONN IC DIP SOCKET ZIF 28POS GLD
Aries Electronics
 58 $16.18
516 Bulk ActiveDIP, ZIF (ZIP)28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-
28-6574-10
28-6574-10
CONN IC DIP SOCKET ZIF 28POS TIN
Aries Electronics
 51 $17.20
57 Bulk ActiveDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Beryllium CopperPolyphenylene Sulfide (PPS), Glass Filled-
40-516-11
40-516-11
CONN IC DIP SOCKET ZIF 40POS GLD
Aries Electronics
 49 $20.26
516 Bulk ActiveDIP, ZIF (ZIP)40 (2 x 20)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperPolyamide (PA46), Nylon 4/6, Glass Filled-