Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	614-41-642-31-002000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	45	$16.10		614	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-91-642-31-002000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	11	$16.19		614	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-43-318-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	24	$15.84		612	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	612-93-318-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	44	$15.85		612	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	TMJ03DKSD-S1512 CONN TRANSIST TO-254 3POS GOLD Sullins Connector Solutions	51	$16.04			Tray	Active	Transistor, TO-254	3 (Rectangular)	0.150" (3.81mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Flange	Solder	0.150" (3.81mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-50°C ~ 175°C
	605-93-640-11-480000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	9	$16.18		605	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	605-43-640-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp.	62	$16.00		605	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	23-7400-10 CONN SOCKET SIP 23POS TIN Aries Electronics	52	$15.86		700 Elevator Strip-Line™	Bulk	Active	SIP	23 (1 x 23)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	34-3503-20 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	51	$16.20		503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	34-3503-30 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	60	$16.19		503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	81-PGM09001-10 CONN SOCKET PGA GOLD Aries Electronics	56	$15.86		PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	126-93-320-41-002000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	26	$16.03		126	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-93-420-41-002000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	36	$16.26		126	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-43-320-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	6	$16.16		126	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	126-43-420-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	18	$16.19		126	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	117-43-316-41-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	26	$16.12		117	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	123-13-424-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	16	$16.00		123	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	114-41-964-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	48	$16.30		114	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	114-91-964-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	19	$16.09		114	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	110-11-648-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	50	$15.89		110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C