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Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
104-11-308-41-780000
104-11-308-41-780000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 20 $12.92
104 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FramePress-Fit0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
210-47-640-41-001000
210-47-640-41-001000
CONN IC DIP SOCKET 40POS GOLD
Mill-Max Manufacturing Corp.
 50 $12.63
210 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)GoldFlashBeryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
123-13-210-41-001000
123-13-210-41-001000
CONN IC DIP SOCKET 10POS GOLD
Mill-Max Manufacturing Corp.
 62 $12.76
123 Tube ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-41-320-41-001000
115-41-320-41-001000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 20 $12.85
115 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-41-420-41-001000
115-41-420-41-001000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 39 $12.88
115 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-91-320-41-001000
115-91-320-41-001000
SKT IC OPEN LOWPRO
Mill-Max Manufacturing Corp.
 6 $12.70
115 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
115-91-420-41-001000
115-91-420-41-001000
SKT IC OPEN LOWPRO
Mill-Max Manufacturing Corp.
 60 $12.90
115 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-91-324-41-001000
110-91-324-41-001000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
 75 $12.88
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-91-424-41-001000
110-91-424-41-001000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
 12 $12.59
110 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-91-624-41-001000
110-91-624-41-001000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
 11 $12.70
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-41-324-41-001000
110-41-324-41-001000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
 4 $12.79
110 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyThermoplastic-
110-41-424-41-001000
110-41-424-41-001000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 40 $12.69
110 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-41-624-41-001000
110-41-624-41-001000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 24 $12.83
110 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
16-810-90
16-810-90
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
 74 $12.84
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
13-7450-10
13-7450-10
CONN SOCKET SIP 13POS TIN
Aries Electronics
 20 $12.74
700 Elevator Strip-Line™ Bulk ActiveSIP13 (1 x 13)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough HoleElevatedSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
13-7970-10
13-7970-10
CONN SOCKET SIP 13POS TIN
Aries Electronics
 6 $12.84
700 Elevator Strip-Line™ Bulk ActiveSIP13 (1 x 13)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough HoleElevatedSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
38-3513-11
38-3513-11
CONN IC DIP SOCKET 38POS GOLD
Aries Electronics
 6 $12.88
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing38 (2 x 19)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
15-0503-21
15-0503-21
CONN SOCKET SIP 15POS GOLD
Aries Electronics
 41 $12.77
0503 Bulk ActiveSIP15 (1 x 15)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Wire Wrap0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA), Nylon, Glass Filled-
15-0503-31
15-0503-31
CONN SOCKET SIP 15POS GOLD
Aries Electronics
 23 $12.60
0503 Bulk ActiveSIP15 (1 x 15)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Wire Wrap0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA), Nylon, Glass Filled-
116-41-308-41-008000
116-41-308-41-008000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 59 $12.77
116 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C