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Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
116-43-310-41-003000
116-43-310-41-003000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 10 $12.57
116 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-13-210-41-001000
110-13-210-41-001000
CONN IC DIP SOCKET 10POS GOLD
Mill-Max Manufacturing Corp.
 45 $12.55
110 Tube ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-41-210-31-002000
614-41-210-31-002000
SKT CARRIER PGA
Mill-Max Manufacturing Corp.
 45 $12.53
614 Tube ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
614-91-210-31-002000
614-91-210-31-002000
SKT CARRIER PGA
Mill-Max Manufacturing Corp.
 41 $12.61
614 Tube ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
17-0501-20
17-0501-20
CONN SOCKET SIP 17POS TIN
Aries Electronics
 47 $12.46
501 Bulk ActiveSIP17 (1 x 17)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough Hole-Wire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
17-0501-30
17-0501-30
CONN SOCKET SIP 17POS TIN
Aries Electronics
 36 $12.38
501 Bulk ActiveSIP17 (1 x 17)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough Hole-Wire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
64-9518-11
64-9518-11
CONN IC DIP SOCKET 64POS GOLD
Aries Electronics
 13 $12.51
518 Bulk ActiveDIP, 0.9" (22.86mm) Row Spacing64 (2 x 32)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
18-6820-90C
18-6820-90C
CONN IC DIP SOCKET 18POS GOLD
Aries Electronics
 66 $12.30
Vertisockets™ 800 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
18-6822-90C
18-6822-90C
CONN IC DIP SOCKET 18POS GOLD
Aries Electronics
 19 $12.42
Vertisockets™ 800 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
18-6823-90C
18-6823-90C
CONN IC DIP SOCKET 18POS GOLD
Aries Electronics
 59 $12.44
Vertisockets™ 800 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
20-822-90C
20-822-90C
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
 69 $12.54
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
20-823-90C
20-823-90C
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
 57 $12.37
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
612-13-310-41-001000
612-13-310-41-001000
SOCKET CARRIER SLDRTL .300 10POS
Mill-Max Manufacturing Corp.
 47 $12.42
612 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-91-420-41-001000
110-91-420-41-001000
CONN IC DIP SOCKET 20POS GOLD
Mill-Max Manufacturing Corp.
 56 $12.52
110 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-41-420-41-001000
110-41-420-41-001000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 79 $12.40
110 Tube ActiveDIP, 0.4" (10.16mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
116-93-306-41-003000
116-93-306-41-003000
CONN IC DIP SOCKET 6POS GOLD
Mill-Max Manufacturing Corp.
 36 $12.60
116 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
116-43-306-41-003000
116-43-306-41-003000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 34 $12.27
116 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
210-99-324-41-001000
210-99-324-41-001000
CONN IC DIP SOCKET 24POS TINLEAD
Mill-Max Manufacturing Corp.
 80 $12.54
210 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin-Lead100.0µin (2.54µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
210-99-624-41-001000
210-99-624-41-001000
CONN IC DIP SOCKET 24POS TINLEAD
Mill-Max Manufacturing Corp.
 2 $12.56
210 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin-Lead100.0µin (2.54µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
210-44-324-41-001000
210-44-324-41-001000
STANDRD SOLDRTL DBL SKT
Mill-Max Manufacturing Corp.
 20 $12.46
210 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C