Sockets for ICs, Transistors

Product List

21968 Items

Mfr Part #	Quantity Available	UnitPrice	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
40-C182-10 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	23	$10.12	EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
24-526-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	14	$11.35	Lo-PRO®file, 526	Bulk	Active	DIP, ZIF (ZIP)	24 (2 x 12)	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
ICF-640-S-O CONN IC DIP SOCKET 40POS TIN Samtec Inc.	49	$13.57	iCF	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
218-3341-00-0602J CONN IC DIP SOCKET ZIF 18POS GLD 3M	13	$22.67	Textool™	Tray	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
228-1277-00-0602J CONN IC DIP SOCKET ZIF 28POS GLD 3M	15	$25.05	Textool™	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
228-1290-00-0602J CONN IC DIP SOCKET ZIF 28POS GLD 3M	4	$26.94	Textool™	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
40-6554-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	5	$27.31	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
224-1286-00-0602J CONN IC DIP SOCKET ZIF 24POS GLD 3M	4	$29.52	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
214-7390-55-1902 CONN SOCKET SOIC 14POS GOLD 3M	13	$33.33	Textool™	Bulk	Active	SOIC	14 (2 x 7)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
228-1371-00-0602J CONN IC DIP SOCKET ZIF 28POS GLD 3M	25	$36.38	Textool™	Tray	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
216-7383-55-1902 CONN SOCKET SOIC 16POS GOLD 3M	24	$36.70	Textool™	Bulk	Active	SOIC	16 (2 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
220-7201-55-1902 CONN SOCKET SOIC 20POS GOLD 3M	3	$42.31	Textool™	Bulk	Active	SOIC	20 (2 x 10)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
240-1288-00-0602J CONN IC DIP SOCKET ZIF 40POS GLD 3M	22	$46.16	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
264-4493-00-0602J CONN IC DIP SOCKET ZIF 64POS GLD 3M	9	$55.21	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
240-5205-00 CONN SOCKET QFN 40POS GOLD 3M	4	$91.17	Textool™	Bulk	Active	QFN	40 (4 x 10)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
224-5205-01 CONN SOCKET QFN 24POS GOLD 3M	4	$96.99	Textool™	Bulk	Active	QFN	24 (4x4)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
228-5204-01 CONN SOCKET QFN 28POS GOLD 3M	2	$100.73	Textool™	Bulk	Active	QFN	28 (4 x 7)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
232-5205-01 CONN SOCKET QFN 32POS GOLD 3M	10	$106.54	Textool™	Bulk	Active	QFN	32 (4 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
288-4205-01 CONN SOCKET QFN 88POS GOLD 3M	6	$167.86	Textool™	Bulk	Active	QFN	88 (4 x 22)	0.016" (0.40mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.016" (0.40mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
EDO-32PLCZSM CONN SOCKET PLCC 32POS On Shore Technology Inc.	127	$0.71	ED	Tube	Active	PLCC	32 (2 x 16)	0.050" (1.27mm)	-	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	-	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 105°C