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Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
550-10-069-11-001101
550-10-069-11-001101
PGA SOLDER TAIL
Preci-Dip
 92 $9.68
550 Bulk ActivePGA69 (11 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
550-10-069-11-061101
550-10-069-11-061101
PGA SOLDER TAIL
Preci-Dip
 64 $9.82
550 Bulk ActivePGA69 (11 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
346-93-152-41-013000
346-93-152-41-013000
CONN SOCKET SIP 52POS GOLD
Mill-Max Manufacturing Corp.
 72 $9.42
346 Bulk ActiveSIP52 (1 x 52)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
08-6810-90
08-6810-90
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 25 $9.38
Vertisockets™ 800 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
346-43-152-41-013000
346-43-152-41-013000
CONN SOCKET SIP 52POS GOLD
Mill-Max Manufacturing Corp.
 24 $9.29
346 Bulk ActiveSIP52 (1 x 52)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
18-3511-11
18-3511-11
CONN IC DIP SOCKET 18POS GOLD
Aries Electronics
 3 $9.30
511 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
10-9503-20
10-9503-20
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
 44 $9.26
503 Bulk ActiveDIP, 0.9" (22.86mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
10-9503-30
10-9503-30
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
 63 $9.41
503 Bulk ActiveDIP, 0.9" (22.86mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
16-3508-20
16-3508-20
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
 51 $9.27
508 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
16-3508-30
16-3508-30
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
 76 $9.27
508 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
714-43-232-31-018000
714-43-232-31-018000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
 29 $9.51
714 Bulk ActiveDIP, 0.1" (2.54mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrier, Closed FrameSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
28-C182-11
28-C182-11
DIP SOCKET
Aries Electronics
 55 $9.52
EJECT-A-DIP™ - ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
37-0511-10
37-0511-10
CONN SOCKET SIP 37POS TIN
Aries Electronics
 45 $9.42
511 Bulk ActiveSIP37 (1 x 37)0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
24-6513-11H
24-6513-11H
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
 37 $9.27
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
26-3513-10H
26-3513-10H
CONN IC DIP SOCKET 26POS GOLD
Aries Electronics
 78 $9.26
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing26 (2 x 13)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
28-C212-11
28-C212-11
CONN IC DIP SOCKET 28POS GOLD
Aries Electronics
 77 $9.31
EJECT-A-DIP™ Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
28-C300-11
28-C300-11
CONN IC DIP SOCKET 28POS GOLD
Aries Electronics
 18 $9.46
EJECT-A-DIP™ Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
116-83-636-41-013101
116-83-636-41-013101
CONN IC DIP SOCKET 36POS GOLD
Preci-Dip
 65 $9.13
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
12-0501-21
12-0501-21
CONN SOCKET SIP 12POS GOLD
Aries Electronics
 59 $9.31
501 Bulk ActiveSIP12 (1 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole-Wire Wrap0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
12-0501-31
12-0501-31
CONN SOCKET SIP 12POS GOLD
Aries Electronics
 19 $9.51
501 Bulk ActiveSIP12 (1 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole-Wire Wrap0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C