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Mfr Part #
Quantity Available
UnitPrice
RFQ
Series
Packaging
Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
98
$1.65
110
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
62
$3.20
Bulk
Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
18
$20.83
Textool™
Tube
Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
21
$33.51
Textool™
Bulk
Active SOIC 8 (2 x 4) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
18
$36.41
Textool™
Bulk
Active SOIC 16 (2 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
18
$44.65
Textool™
Tube
Active DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
7
$92.36
PRS
Bulk
Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
2,245
$0.27
ICS
Tube
Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
1,481
$0.42
ICM
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
808
$0.79
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
757
$0.50
110
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
959
$0.60
110
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
970
$0.63
110
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
943
$0.74
SA
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
687
$1.06
DILB
Tube
Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
999
$0.82
D01-997
Tube
Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled -55°C ~ 125°C
228
$0.83
518
Bulk
Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
128
$0.87
4800
Tube
Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
426
$0.95
SA
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
755
$0.94
110
Tube
Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C