Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	10-0508-21 CONN SOCKET SIP 10POS GOLD Aries Electronics	37	$8.72		508	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	10-0508-31 CONN SOCKET SIP 10POS GOLD Aries Electronics	13	$8.80		508	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	10-1508-21 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	12	$8.84		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	10-1508-31 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	93	$8.75		508	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
	714-43-133-31-018000 CONN SOCKET SIP 33POS GOLD Mill-Max Manufacturing Corp.	71	$8.86		714	Bulk	Active	SIP	33 (1 x 33)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-83-069-11-061112 CONN SOCKET PGA 69POS GOLD Preci-Dip	53	$9.17		614	Bulk	Active	PGA	69 (11 x 11)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	714-43-230-31-018000 CONN IC DIP SOCKET 30POS GOLD Mill-Max Manufacturing Corp.	62	$8.66		714	Bulk	Active	DIP, 0.1" (2.54mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	510-87-273-21-121101 CONN SOCKET PGA 273POS GOLD Preci-Dip	97	$9.12		510	Bulk	Active	PGA	273 (21 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	50-9513-10 CONN IC DIP SOCKET 50POS GOLD Aries Electronics	3	$8.86		Lo-PRO®file, 513	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	21-0517-90C CONN SOCKET SIP 21POS GOLD Aries Electronics	29	$8.94		0517	Bulk	Active	SIP	21 (1 x 21)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	APA-324-G-J ADAPTER PLUG Samtec Inc.	61	$8.94		APA	Tube	Active	-	24 (2 x 12)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
	346-93-149-41-013000 CONN SOCKET SIP 49POS GOLD Mill-Max Manufacturing Corp.	102	$8.84		346	Bulk	Active	SIP	49 (1 x 49)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	346-43-149-41-013000 CONN SOCKET SIP 49POS GOLD Mill-Max Manufacturing Corp.	45	$8.96		346	Bulk	Active	SIP	49 (1 x 49)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	22-6501-20 CONN IC DIP SOCKET 22POS TIN Aries Electronics	28	$8.74		501	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	22-6501-30 CONN IC DIP SOCKET 22POS TIN Aries Electronics	112	$8.83		501	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
	09-0501-20 CONN SOCKET SIP 9POS TIN Aries Electronics	75	$8.89		501	Bulk	Active	SIP	9 (1 x 9)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	09-0501-30 CONN SOCKET SIP 9POS TIN Aries Electronics	80	$8.89		501	Bulk	Active	SIP	9 (1 x 9)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	123-13-304-41-001000 CONN IC DIP SOCKET 4POS GOLD Mill-Max Manufacturing Corp.	57	$8.84		123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	614-87-085-11-041112 CONN SOCKET PGA 85POS GOLD Preci-Dip	10	$9.10		614	Bulk	Active	PGA	85 (11 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	510-87-299-20-001101 CONN SOCKET PGA 299POS GOLD Preci-Dip	9	$9.19		510	Bulk	Active	PGA	299 (20 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C