Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available
UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
13-0511-10
13-0511-10
CONN SOCKET SIP 13POS TIN
Aries Electronics
76 $7.18
511 Bulk ActiveSIP13 (1 x 13)0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
16-3518-10E
16-3518-10E
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
57 $7.11
518 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
116-87-632-41-013101
116-87-632-41-013101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
102 $7.33
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
APA-422-T-M
APA-422-T-M
ADAPTER PLUG
Samtec Inc.
102 $7.12
APA Bulk Active-22 (2 x 11)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT), Glass Filled-
10-6511-11
10-6511-11
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
2 $7.12
511 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
116-47-304-41-006000
116-47-304-41-006000
STANDRD SOLDRTL DBL SKT
Mill-Max Manufacturing Corp.
79 $7.07
116 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing4 (2 x 2)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
16-822-90E
16-822-90E
16 PIN RT ANGLE HORIZONTAL SOCKT
Aries Electronics
89 $7.10
Vertisockets™ 800 - ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzeThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzePolyamide (PA46), Nylon 4/6105°C
123-43-320-41-801000
123-43-320-41-801000
CONN IC DIP SOCKET 20POS GOLD
Mill-Max Manufacturing Corp.
138 $7.22
123 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen Frame, Decoupling CapacitorWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
346-93-138-41-013000
346-93-138-41-013000
CONN SOCKET SIP 38POS GOLD
Mill-Max Manufacturing Corp.
24 $7.17
346 Bulk ActiveSIP38 (1 x 38)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
346-43-138-41-013000
346-43-138-41-013000
CONN SOCKET SIP 38POS GOLD
Mill-Max Manufacturing Corp.
23 $7.14
346 Bulk ActiveSIP38 (1 x 38)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
40-3513-10
40-3513-10
CONN IC DIP SOCKET 40POS GOLD
Aries Electronics
70 $7.23
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
08-810-90T
08-810-90T
CONN IC DIP SOCKET 8POS TIN
Aries Electronics
6 $7.07
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough Hole, Right Angle, VerticalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6-
116-41-304-41-006000
116-41-304-41-006000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
17 $7.19
116 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing4 (2 x 2)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
116-91-304-41-006000
116-91-304-41-006000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
122 $7.23
116 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing4 (2 x 2)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
510-83-148-15-061101
510-83-148-15-061101
CONN SOCKET PGA 148POS GOLD
Preci-Dip
82 $7.45
510 Bulk ActivePGA148 (15 x 15)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-83-148-15-062101
510-83-148-15-062101
CONN SOCKET PGA 148POS GOLD
Preci-Dip
97 $7.57
510 Bulk ActivePGA148 (15 x 15)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
32-9513-10
32-9513-10
CONN IC DIP SOCKET 32POS GOLD
Aries Electronics
31 $7.23
Lo-PRO®file, 513 Bulk ActiveDIP, 0.9" (22.86mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
24-4518-10H
24-4518-10H
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
91 $7.24
518 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
15-0508-20
15-0508-20
CONN SOCKET SIP 15POS GOLD
Aries Electronics
60 $7.19
508 Bulk ActiveSIP15 (1 x 15)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Wire Wrap-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6-55°C ~ 105°C
15-0508-30
15-0508-30
CONN SOCKET SIP 15POS GOLD
Aries Electronics
34 $7.14
508 Bulk ActiveSIP15 (1 x 15)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Wire Wrap-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6-55°C ~ 105°C