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Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
22-0518-11H
22-0518-11H
CONN SOCKET SIP 22POS GOLD
Aries Electronics
 74 $6.44
518 Bulk ActiveSIP22 (1 x 22)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
22-1518-11H
22-1518-11H
CONN IC DIP SOCKET 22POS GOLD
Aries Electronics
 35 $6.41
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
07-0508-21
07-0508-21
CONN SOCKET SIP 7POS GOLD
Aries Electronics
 139 $6.54
508 Bulk ActiveSIP7 (1 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Wire Wrap-Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6-55°C ~ 125°C
07-0508-31
07-0508-31
CONN SOCKET SIP 7POS GOLD
Aries Electronics
 30 $6.48
508 Bulk ActiveSIP7 (1 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Wire Wrap-Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6-55°C ~ 125°C
48-6513-10
48-6513-10
CONN IC DIP SOCKET 48POS GOLD
Aries Electronics
 76 $6.56
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
111-41-304-41-001000
111-41-304-41-001000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 100 $6.45
111 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing4 (2 x 2)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
111-91-304-41-001000
111-91-304-41-001000
CONN IC SKT DBL
Mill-Max Manufacturing Corp.
 141 $6.46
111 Tube ActiveDIP, 0.3" (7.62mm) Row Spacing4 (2 x 2)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
14-3503-20
14-3503-20
CONN IC DIP SOCKET 14POS GOLD
Aries Electronics
 96 $6.56
503 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
24-4518-10M
24-4518-10M
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
 95 $6.56
518 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
26-0518-00
26-0518-00
CONN SOCKET SIP 26POS GOLD
Aries Electronics
 15 $6.58
518 Bulk ActiveSIP26 (1 x 26)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
26-1518-00
26-1518-00
CONN IC DIP SOCKET 26POS GOLD
Aries Electronics
 15 $6.45
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing26 (2 x 13)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
28-3518-101
28-3518-101
CONN IC DIP SOCKET 28POS GOLD
Aries Electronics
 135 $6.46
518 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
28-6518-101
28-6518-101
CONN IC DIP SOCKET 28POS GOLD
Aries Electronics
 151 $6.44
518 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
08-2820-90C
08-2820-90C
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 126 $6.59
Vertisockets™ 800 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
08-2822-90C
08-2822-90C
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 117 $6.49
Vertisockets™ 800 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
08-2823-90C
08-2823-90C
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 17 $6.45
Vertisockets™ 800 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
116-83-628-41-013101
116-83-628-41-013101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 13 $6.71
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-328-41-013101
116-83-328-41-013101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 90 $6.74
116 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-428-41-013101
116-83-428-41-013101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 131 $6.74
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
APA-628-T-A1
APA-628-T-A1
ADAPTER PLUG
Samtec Inc.
 66 $6.59
APA Bulk Active-28 (2 x 14)0.100" (2.54mm)Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Phosphor BronzePolybutylene Terephthalate (PBT), Glass Filled-