Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	04-7700-10 CONN SOCKET SIP 4POS TIN Aries Electronics	114	$6.06		700 Elevator Strip-Line™	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	04-7755-10 CONN SOCKET SIP 4POS TIN Aries Electronics	42	$6.09		700 Elevator Strip-Line™	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	04-7800-10 CONN SOCKET SIP 4POS TIN Aries Electronics	83	$6.02		700 Elevator Strip-Line™	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	04-7850-10 CONN SOCKET SIP 4POS TIN Aries Electronics	47	$6.00		700 Elevator Strip-Line™	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	04-7950-10 CONN SOCKET SIP 4POS TIN Aries Electronics	130	$6.08		700 Elevator Strip-Line™	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	XR2A3221N CONN IC DIP SOCKET 32POS GOLD Omron Electronics Inc-EMC Div	100	$6.12		XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Threaded	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
	ICA-324-SGT .100" SCREW MACHINE DIP SOCKET Samtec Inc.	72	$6.03		ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
	124-83-642-41-002101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	133	$6.15		124	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	714-43-122-31-018000 CONN SOCKET SIP 22POS GOLD Mill-Max Manufacturing Corp.	113	$6.17		714	Bulk	Active	SIP	22 (1 x 22)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	714-43-220-31-018000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	126	$6.07		714	Bulk	Active	DIP, 0.1" (2.54mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
	116-87-636-41-004101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	75	$6.37		116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	06-0511-10 CONN SOCKET SIP 6POS TIN Aries Electronics	18	$6.09		511	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	30-9513-10T CONN IC DIP SOCKET 30POS GOLD Aries Electronics	114	$6.15		Lo-PRO®file, 513	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	19-0513-11H CONN SOCKET SIP 19POS GOLD Aries Electronics	57	$6.17		0513	Bulk	Active	SIP	19 (1 x 19)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	510-87-207-17-081101 CONN SOCKET PGA 207POS GOLD Preci-Dip	46	$6.14		510	Bulk	Active	PGA	207 (17 x 17)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	510-87-207-17-082101 CONN SOCKET PGA 207POS GOLD Preci-Dip	28	$6.15		510	Bulk	Active	PGA	207 (17 x 17)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	23-0513-11 CONN SOCKET SIP 23POS GOLD Aries Electronics	115	$6.17		0513	Bulk	Active	SIP	23 (1 x 23)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	22-4518-10M CONN IC DIP SOCKET 22POS GOLD Aries Electronics	153	$6.21		518	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	APA-314-T-B ADAPTER PLUG Samtec Inc.	90	$6.26		APA	Bulk	Active	-	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
	18-3513-10H CONN IC DIP SOCKET 18POS GOLD Aries Electronics	16	$6.17		Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C