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Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
33-0518-11
33-0518-11
CONN SOCKET SIP 33POS GOLD
Aries Electronics
 37 $5.75
518 Bulk ActiveSIP33 (1 x 33)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
13-0517-90C
13-0517-90C
CONN SOCKET SIP 13POS GOLD
Aries Electronics
 129 $5.71
0517 Bulk ActiveSIP13 (1 x 13)-Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle-Solder-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
08-0501-20
08-0501-20
CONN SOCKET SIP 8POS TIN
Aries Electronics
 39 $5.71
501 Bulk ActiveSIP8 (1 x 8)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough Hole-Wire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
08-0501-30
08-0501-30
CONN SOCKET SIP 8POS TIN
Aries Electronics
 91 $5.83
501 Bulk ActiveSIP8 (1 x 8)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough Hole-Wire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
22-3513-11
22-3513-11
CONN IC DIP SOCKET 22POS GOLD
Aries Electronics
 162 $5.74
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
550-80-056-09-041101
550-80-056-09-041101
PGA SOLDER TAIL
Preci-Dip
 24 $6.04
550 Bulk ActivePGA56 (9 x 9)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
39-0518-10H
39-0518-10H
CONN SOCKET SIP 39POS GOLD
Aries Electronics
 35 $5.82
518 Bulk ActiveSIP39 (1 x 39)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
14-3518-111
14-3518-111
CONN IC DIP SOCKET 14POS GOLD
Aries Electronics
 73 $5.74
518 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
116-83-324-41-013101
116-83-324-41-013101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
 34 $6.04
116 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-424-41-013101
116-83-424-41-013101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
 164 $6.07
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-624-41-013101
116-83-624-41-013101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
 4 $5.98
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
10-2503-20
10-2503-20
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
 72 $5.81
503 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
10-2503-30
10-2503-30
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
 130 $5.83
503 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
10-3503-20
10-3503-20
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
 100 $5.84
503 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
10-3503-30
10-3503-30
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
 34 $5.80
503 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
16-3518-102
16-3518-102
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
 69 $5.74
518 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
08-820-90C
08-820-90C
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 151 $5.77
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
08-822-90C
08-822-90C
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 19 $5.78
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
08-823-90C
08-823-90C
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 2 $5.73
Vertisockets™ 800 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
714-43-120-31-018000
714-43-120-31-018000
CONN SOCKET SIP 20POS GOLD
Mill-Max Manufacturing Corp.
 19 $5.81
714 Tube ActiveSIP20 (1 x 20)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrierSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C