English

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
24-3518-10H
24-3518-10H
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
 49 $5.59
518 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
116-87-648-41-008101
116-87-648-41-008101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
 126 $5.83
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
ICO-624-SGT
ICO-624-SGT
CONN IC DIP SOCKET 24POS GOLD
Samtec Inc.
 83 $5.56
ICO Tube ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolyester, Glass Filled-55°C ~ 125°C
116-87-652-41-007101
116-87-652-41-007101
CONN IC DIP SOCKET 52POS GOLD
Preci-Dip
 18 $5.80
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing52 (2 x 26)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
10-6501-20
10-6501-20
CONN IC DIP SOCKET 10POS TIN
Aries Electronics
 133 $5.52
501 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
10-6501-30
10-6501-30
CONN IC DIP SOCKET 10POS TIN
Aries Electronics
 26 $5.47
501 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
550-10-037-10-061101
550-10-037-10-061101
PGA SOLDER TAIL
Preci-Dip
 163 $5.84
550 Bulk ActivePGA37 (10 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
ICF-632-T-O
ICF-632-T-O
.100" SURFACE MOUNT SCREW MACHIN
Samtec Inc.
 134 $5.54
iCF Tube ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Tin-Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)Tin-Beryllium CopperLiquid Crystal Polymer (LCP)-55°C ~ 125°C
32-6513-10
32-6513-10
CONN IC DIP SOCKET 32POS GOLD
Aries Electronics
 116 $5.61
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
04-0501-21
04-0501-21
CONN SOCKET SIP 4POS GOLD
Aries Electronics
 101 $5.53
501 Bulk ActiveSIP4 (1 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole-Wire Wrap0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
04-0501-31
04-0501-31
CONN SOCKET SIP 4POS GOLD
Aries Electronics
 161 $5.53
501 Bulk ActiveSIP4 (1 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough Hole-Wire Wrap0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
09-0503-20
09-0503-20
CONN SOCKET SIP 9POS GOLD
Aries Electronics
 18 $5.59
0503 Bulk ActiveSIP9 (1 x 9)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Wire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA), Nylon, Glass Filled-
09-0503-30
09-0503-30
CONN SOCKET SIP 9POS GOLD
Aries Electronics
 115 $5.58
0503 Bulk ActiveSIP9 (1 x 9)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Wire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA), Nylon, Glass Filled-
116-83-648-41-002101
116-83-648-41-002101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
 50 $5.89
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-650-41-007101
116-83-650-41-007101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
 121 $5.85
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-650-41-002101
116-87-650-41-002101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
 145 $5.80
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
20-3513-00
20-3513-00
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
 139 $5.59
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
20-4518-10M
20-4518-10M
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
 37 $5.59
518 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
18-0518-11H
18-0518-11H
CONN SOCKET SIP 18POS GOLD
Aries Electronics
 138 $5.59
518 Bulk ActiveSIP18 (1 x 18)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
18-1518-11H
18-1518-11H
CONN IC DIP SOCKET 18POS GOLD
Aries Electronics
 166 $5.60
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-