Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available
UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
08-3511-11
08-3511-11
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
70 $5.09
511 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 125°C
122-87-650-41-001101
122-87-650-41-001101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
152 $5.21
122 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
123-87-650-41-001101
123-87-650-41-001101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
32 $5.35
123 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-652-41-009101
116-87-652-41-009101
CONN IC DIP SOCKET 52POS GOLD
Preci-Dip
155 $5.30
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing52 (2 x 26)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-83-108-12-051101
510-83-108-12-051101
CONN SOCKET PGA 108POS GOLD
Preci-Dip
49 $5.25
510 Bulk ActivePGA108 (12 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
16-3518-101
16-3518-101
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
75 $5.16
518 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
346-93-126-41-013000
346-93-126-41-013000
CONN SOCKET SIP 26POS GOLD
Mill-Max Manufacturing Corp.
183 $5.04
346 Bulk ActiveSIP26 (1 x 26)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
346-43-126-41-013000
346-43-126-41-013000
CONN SOCKET SIP 26POS GOLD
Mill-Max Manufacturing Corp.
74 $5.13
346 Bulk ActiveSIP26 (1 x 26)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
510-87-172-16-001101
510-87-172-16-001101
CONN SOCKET PGA 172POS GOLD
Preci-Dip
130 $5.37
510 Bulk ActivePGA172 (16 x 16)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
714-43-216-31-018000
714-43-216-31-018000
CONN IC DIP SOCKET 16POS GOLD
Mill-Max Manufacturing Corp.
147 $5.03
714 Bulk ActiveDIP, 0.1" (2.54mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrier, Closed FrameSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
116-87-648-41-007101
116-87-648-41-007101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
20 $5.26
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
28-0518-11
28-0518-11
CONN SOCKET SIP 28POS GOLD
Aries Electronics
29 $5.05
518 Bulk ActiveSIP28 (1 x 28)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
28-1518-11
28-1518-11
CONN IC DIP SOCKET 28POS GOLD
Aries Electronics
149 $5.18
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
10-0508-20
10-0508-20
CONN SOCKET SIP 10POS GOLD
Aries Electronics
47 $5.08
508 Bulk ActiveSIP10 (1 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Wire Wrap-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6-55°C ~ 105°C
10-0508-30
10-0508-30
CONN SOCKET SIP 10POS GOLD
Aries Electronics
114 $5.18
508 Bulk ActiveSIP10 (1 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Wire Wrap-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6-55°C ~ 105°C
10-1508-20
10-1508-20
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
6 $5.07
508 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6-55°C ~ 105°C
10-1508-30
10-1508-30
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
30 $5.06
508 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6-55°C ~ 105°C
11-0517-90C
11-0517-90C
CONN SOCKET SIP 11POS GOLD
Aries Electronics
110 $5.16
0517 Bulk ActiveSIP11 (1 x 11)-Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle-Solder-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
XR2A-2801-N
XR2A-2801-N
CONN IC DIP SOCKET 28POS GOLD
Omron Electronics Inc-EMC Div
75 $5.16
XR2 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperPolybutylene Terephthalate (PBT), Glass Filled-55°C ~ 125°C
08-6501-20
08-6501-20
CONN IC DIP SOCKET 8POS TIN
Aries Electronics
43 $5.15
501 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C