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My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
33-0518-10T
33-0518-10T
CONN SOCKET SIP 33POS GOLD
Aries Electronics
 86 $4.16
518 Bulk ActiveSIP33 (1 x 33)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
48-6518-10T
48-6518-10T
CONN IC DIP SOCKET 48POS GOLD
Aries Electronics
 125 $4.08
518 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
28-6513-10T
28-6513-10T
CONN IC DIP SOCKET 28POS GOLD
Aries Electronics
 166 $4.09
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
510-83-088-13-001101
510-83-088-13-001101
CONN SOCKET PGA 88POS GOLD
Preci-Dip
 111 $4.26
510 Bulk ActivePGA88 (13 x 13)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-83-088-13-062101
510-83-088-13-062101
CONN SOCKET PGA 88POS GOLD
Preci-Dip
 208 $4.29
510 Bulk ActivePGA88 (13 x 13)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-83-088-13-081101
510-83-088-13-081101
CONN SOCKET PGA 88POS GOLD
Preci-Dip
 198 $4.31
510 Bulk ActivePGA88 (13 x 13)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-83-088-12-051101
510-83-088-12-051101
CONN SOCKET PGA 88POS GOLD
Preci-Dip
 48 $4.28
510 Bulk ActivePGA88 (12 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-83-088-12-052101
510-83-088-12-052101
CONN SOCKET PGA 88POS GOLD
Preci-Dip
 38 $4.28
510 Bulk ActivePGA88 (12 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
110-83-632-41-105191
110-83-632-41-105191
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
 46 $4.31
110 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperSurface MountOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-642-41-012101
116-83-642-41-012101
CONN IC DIP SOCKET 42POS GOLD
Preci-Dip
 53 $4.34
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing42 (2 x 21)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-87-136-14-051101
510-87-136-14-051101
CONN SOCKET PGA 136POS GOLD
Preci-Dip
 123 $4.38
510 Bulk ActivePGA136 (14 x 14)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-428-41-011101
116-83-428-41-011101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 35 $4.32
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-628-41-011101
116-83-628-41-011101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 224 $4.38
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-328-41-011101
116-83-328-41-011101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 56 $4.31
116 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
24-3513-10
24-3513-10
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
 178 $4.18
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
550-80-037-10-061101
550-80-037-10-061101
PGA SOLDER TAIL
Preci-Dip
 11 $4.29
550 Bulk ActivePGA37 (10 x 10)0.100" (2.54mm)Tin-Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
614-83-950-41-001101
614-83-950-41-001101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
 21 $4.34
614 Bulk ActiveDIP, 0.9" (22.86mm) Row Spacing50 (2 x 25)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
14-C280-10
14-C280-10
CONN IC DIP SOCKET 14POS GOLD
Aries Electronics
 58 $4.18
EJECT-A-DIP™ Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
08-3503-20
08-3503-20
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 184 $4.16
503 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
08-3503-30
08-3503-30
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 126 $4.15
503 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameWire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C