Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items

PDF	Mfr Part #	Quantity Available	UnitPrice	RFQ	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	110-83-648-41-105101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	38	$4.11		110	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	10-6511-10 SOCKET 10 POS SOLDER TAIL TIN Aries Electronics	209	$3.98		511	-	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	540-44-044-17-400004 CONN SKT PLCC Mill-Max Manufacturing Corp.	108	$3.97		540	Tape & Reel (TR)	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	-	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	200.0µin (5.08µm)	-	Polyphenylene Sulfide (PPS)	-
	116-83-642-41-003101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	160	$4.06		116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	10-6513-10H CONN IC DIP SOCKET 10POS GOLD Aries Electronics	180	$3.98		Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	29-0518-10H CONN SOCKET SIP 29POS GOLD Aries Electronics	171	$3.95		518	Bulk	Active	SIP	29 (1 x 29)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	146-87-642-41-035101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	115	$4.11		146	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	146-87-642-41-036101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	228	$4.16		146	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	08-0511-10 CONN SOCKET SIP 8POS TIN Aries Electronics	184	$3.92		511	Bulk	Active	SIP	8 (1 x 8)	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	18-3518-10H CONN IC DIP SOCKET 18POS GOLD Aries Electronics	113	$3.92		518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	116-83-432-41-009101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	221	$4.16		116	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
	16-3518-10M CONN IC DIP SOCKET 16POS GOLD Aries Electronics	133	$4.02		518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
	14-81000-10WR CONN IC DIP SOCKET 14POS TIN Aries Electronics	189	$3.95		8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	14-81100-10WR CONN IC DIP SOCKET 14POS TIN Aries Electronics	163	$4.03		8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	14-81187-10WR CONN IC DIP SOCKET 14POS TIN Aries Electronics	143	$3.97		8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	14-81250-10WR CONN IC DIP SOCKET 14POS TIN Aries Electronics	2	$3.96		8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	14-8260-10WR CONN IC DIP SOCKET 14POS TIN Aries Electronics	222	$3.96		8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	14-8350-10WR CONN IC DIP SOCKET 14POS TIN Aries Electronics	234	$4.04		8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	14-8400-10WR CONN IC DIP SOCKET 14POS TIN Aries Electronics	222	$4.01		8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	14-8435-10WR CONN IC DIP SOCKET 14POS TIN Aries Electronics	118	$4.00		8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C