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My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
30-1518-10
30-1518-10
CONN IC DIP SOCKET 30POS GOLD
Aries Electronics
 66 $3.41
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing30 (2 x 15)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
08-0517-90C
08-0517-90C
CONN SOCKET SIP 8POS GOLD
Aries Electronics
 203 $3.48
0517 Bulk ActiveSIP8 (1 x 8)-Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle-Solder-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
116-83-328-41-001101
116-83-328-41-001101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 114 $3.59
116 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-428-41-001101
116-83-428-41-001101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 121 $3.56
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
214-44-316-01-670799
214-44-316-01-670799
STANDRD SOLDER TAIL DIP SOCKET
Mill-Max Manufacturing Corp.
 187 $3.48
214 Tape & Reel (TR) ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolyamide (PA46), Nylon 4/6-55°C ~ 125°C
214-99-316-01-670799
214-99-316-01-670799
STANDRD SOLDER TAIL DIP SOCKET
Mill-Max Manufacturing Corp.
 126 $3.52
214 Tape & Reel (TR) ActiveDIP, 0.3" (7.62mm) Row Spacing16 (2 x 8)0.100" (2.54mm)Tin-Lead100.0µin (2.54µm)Beryllium CopperSurface MountClosed FrameSolder0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolyamide (PA46), Nylon 4/6-55°C ~ 125°C
121-83-432-41-001101
121-83-432-41-001101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
 120 $3.57
121 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
714-43-112-31-018000
714-43-112-31-018000
CONN SOCKET SIP 12POS GOLD
Mill-Max Manufacturing Corp.
 103 $3.49
714 Tube ActiveSIP12 (1 x 12)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrierSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
11-0513-11H
11-0513-11H
CONN SOCKET SIP 11POS GOLD
Aries Electronics
 241 $3.45
0513 Bulk ActiveSIP11 (1 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
16-0513-11
16-0513-11
CONN SOCKET SIP 16POS GOLD
Aries Electronics
 253 $3.44
0513 Bulk ActiveSIP16 (1 x 16)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
06-0503-20
06-0503-20
CONN SOCKET SIP 6POS GOLD
Aries Electronics
 69 $3.45
0503 Bulk ActiveSIP6 (1 x 6)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Wire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA), Nylon, Glass Filled-
06-0503-30
06-0503-30
CONN SOCKET SIP 6POS GOLD
Aries Electronics
 148 $3.44
0503 Bulk ActiveSIP6 (1 x 6)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Wire Wrap0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA), Nylon, Glass Filled-
146-83-632-41-035101
146-83-632-41-035101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
 197 $3.68
146 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FramePress-Fit0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
146-83-632-41-036101
146-83-632-41-036101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
 6 $3.64
146 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FramePress-Fit0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-650-41-003101
116-87-650-41-003101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
 223 $3.60
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
124-83-424-41-002101
124-83-424-41-002101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
 107 $3.60
124 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
124-83-624-41-002101
124-83-624-41-002101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
 15 $3.62
124 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
115-83-650-41-003101
115-83-650-41-003101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
 124 $3.66
115 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-628-41-009101
116-83-628-41-009101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 34 $3.66
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-428-41-009101
116-83-428-41-009101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 55 $3.61
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C