Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available
UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
22-0518-10H
22-0518-10H
CONN SOCKET SIP 22POS GOLD
Aries Electronics
123 $3.07
518 Bulk ActiveSIP22 (1 x 22)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
22-1518-10H
22-1518-10H
CONN IC DIP SOCKET 22POS GOLD
Aries Electronics
211 $3.07
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
26-0518-10
26-0518-10
CONN SOCKET SIP 26POS GOLD
Aries Electronics
290 $3.02
518 Bulk ActiveSIP26 (1 x 26)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
07-0517-90C
07-0517-90C
CONN SOCKET SIP 7POS GOLD
Aries Electronics
30 $3.07
0517 Bulk ActiveSIP7 (1 x 7)-Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle-Solder-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
116-83-328-41-008101
116-83-328-41-008101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
213 $3.12
116 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
20-3513-10
20-3513-10
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
54 $3.06
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
510-87-100-15-001101
510-87-100-15-001101
CONN SOCKET PGA 100POS GOLD
Preci-Dip
288 $3.18
510 Bulk ActivePGA100 (15 x 15)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
510-87-100-15-101101
510-87-100-15-101101
CONN SOCKET PGA 100POS GOLD
Preci-Dip
37 $3.21
510 Bulk ActivePGA100 (15 x 15)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-632-41-008101
116-87-632-41-008101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
269 $3.23
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing32 (2 x 16)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
614-83-636-31-012101
614-83-636-31-012101
CONN IC DIP SOCKET 36POS GOLD
Preci-Dip
114 $3.21
614 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing36 (2 x 18)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
02-0511-10
02-0511-10
CONN SOCKET SIP 2POS TIN
Aries Electronics
48 $3.09
511 Bulk ActiveSIP2 (1 x 2)0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzeThrough Hole-Solder0.100" (2.54mm)Tin50.0µin (1.27µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
04-3513-11H
04-3513-11H
CONN IC DIP SOCKET 4POS GOLD
Aries Electronics
151 $3.02
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing4 (2 x 2)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
18-1518-11
18-1518-11
CONN IC DIP SOCKET 18POS GOLD
Aries Electronics
173 $3.07
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
24-0518-10T
24-0518-10T
CONN SOCKET SIP 24POS GOLD
Aries Electronics
299 $3.06
518 Bulk ActiveSIP24 (1 x 24)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
24-1518-10T
24-1518-10T
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
257 $3.10
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
110-83-648-41-005101
110-83-648-41-005101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
239 $3.18
110 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing48 (2 x 24)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
117-93-620-41-005000
117-93-620-41-005000
CONN IC DIP SOCKET 20POS GOLD
Mill-Max Manufacturing Corp.
163 $3.03
117 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing20 (2 x 10)0.070" (1.78mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
117-43-620-41-005000
117-43-620-41-005000
CONN IC DIP SOCKET 20POS GOLD
Mill-Max Manufacturing Corp.
199 $3.06
117 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing20 (2 x 10)0.070" (1.78mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleOpen FrameSolder0.070" (1.78mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
510-87-101-15-101101
510-87-101-15-101101
CONN SOCKET PGA 101POS GOLD
Preci-Dip
57 $3.24
510 Bulk ActivePGA101 (15 x 15)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
14-6513-10
14-6513-10
CONN IC DIP SOCKET 14POS GOLD
Aries Electronics
289 $3.11
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C