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My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
116-83-422-41-001101
116-83-422-41-001101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
 326 $2.68
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
115-83-640-41-003101
115-83-640-41-003101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
 97 $2.63
115 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
346-93-113-41-013000
346-93-113-41-013000
CONN SOCKET SIP 13POS GOLD
Mill-Max Manufacturing Corp.
 5 $2.52
346 Bulk ActiveSIP13 (1 x 13)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
346-43-113-41-013000
346-43-113-41-013000
CONN SOCKET SIP 13POS GOLD
Mill-Max Manufacturing Corp.
 330 $2.58
346 Bulk ActiveSIP13 (1 x 13)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
714-43-208-31-018000
714-43-208-31-018000
CONN IC DIP SOCKET 8POS GOLD
Mill-Max Manufacturing Corp.
 31 $2.53
714 Bulk ActiveDIP, 0.1" (2.54mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough HoleCarrier, Closed FrameSolder0.100" (2.54mm)Gold30.0µin (0.76µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
110-83-640-41-005101
110-83-640-41-005101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
 295 $2.68
110 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
110-83-640-41-605101
110-83-640-41-605101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
 147 $2.67
110 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing40 (2 x 20)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
115-87-952-41-001101
115-87-952-41-001101
CONN IC DIP SOCKET 52POS GOLD
Preci-Dip
 113 $2.63
115 Bulk ActiveDIP, 0.9" (22.86mm) Row Spacing52 (2 x 26)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
14-3518-11
14-3518-11
CONN IC DIP SOCKET 14POS GOLD
Aries Electronics
 81 $2.54
518 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
10-2511-10
10-2511-10
10-PIN SOLDER TAIL IC SOCKET
Aries Electronics
 92 $2.56
511 - ActiveDIP, 0.2" (5.08mm) Row Spacing10 (2 x 5)0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzeThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)Phosphor BronzePolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
20-4518-10
20-4518-10
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
 237 $2.57
518 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
09-0518-11H
09-0518-11H
CONN SOCKET SIP 9POS GOLD
Aries Electronics
 217 $2.56
518 Bulk ActiveSIP9 (1 x 9)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
299-83-314-11-001101
299-83-314-11-001101
CONN IC DIP SOCKET 14POS GOLD
Preci-Dip
 55 $2.66
299 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing14 (2 x 7)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
146-87-432-41-035101
146-87-432-41-035101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
 252 $2.69
146 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing32 (2 x 16)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
146-87-432-41-036101
146-87-432-41-036101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
 243 $2.72
146 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing32 (2 x 16)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FramePress-Fit0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
808-AG11D
808-AG11D
CONN IC DIP SOCKET 8POS GOLD
TE Connectivity AMP Connectors
 145 $2.55
800 Tube ObsoleteDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold25.0µin (0.63µm)Copper AlloyThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-Lead80.0µin (2.03µm)Copper AlloyPolyester-55°C ~ 105°C
299-87-612-10-002101
299-87-612-10-002101
CONN IC DIP SOCKET 12POS GOLD
Preci-Dip
 76 $2.71
299 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing12 (2 x 6)0.100" (2.54mm)GoldFlashBeryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-87-624-41-001101
116-87-624-41-001101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
 184 $2.72
116 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing24 (2 x 12)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
08-6513-10H
08-6513-10H
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 243 $2.56
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
22-4518-10T
22-4518-10T
CONN IC DIP SOCKET 22POS GOLD
Aries Electronics
 218 $2.58
518 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing22 (2 x 11)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-