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My RFQ

Sockets for ICs, Transistors

Category Introduction

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

Product List

21968 Items
PDF Mfr Part # Quantity
Available		 UnitPrice RFQ Series Packaging Product StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
05-0517-90C
05-0517-90C
CONN SOCKET SIP 5POS GOLD
Aries Electronics
 342 $2.09
0517 Bulk ActiveSIP5 (1 x 5)-Gold30.0µin (0.76µm)Beryllium CopperThrough Hole, Right Angle-Solder-Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
346-93-110-41-013000
346-93-110-41-013000
CONN SOCKET SIP 10POS GOLD
Mill-Max Manufacturing Corp.
 104 $2.13
346 Tube ActiveSIP10 (1 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin-Lead200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
346-43-110-41-013000
346-43-110-41-013000
CONN SOCKET SIP 10POS GOLD
Mill-Max Manufacturing Corp.
 292 $2.13
346 Bulk ActiveSIP10 (1 x 10)0.100" (2.54mm)Gold30.0µin (0.76µm)Beryllium CopperThrough Hole-Press-Fit0.100" (2.54mm)Tin200.0µin (5.08µm)Brass AlloyPolycyclohexylenedimethylene Terephthalate (PCT), Polyester-55°C ~ 125°C
116-83-420-41-002101
116-83-420-41-002101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
 395 $2.22
116 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
612-87-432-41-001101
612-87-432-41-001101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
 72 $2.22
612 Bulk ActiveDIP, 0.4" (10.16mm) Row Spacing32 (2 x 16)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
110-87-650-41-001101
110-87-650-41-001101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
 34 $2.20
110 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
116-83-320-41-009101
116-83-320-41-009101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
 432 $2.23
116 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing20 (2 x 10)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
06-6513-11
06-6513-11
CONN IC DIP SOCKET 6POS GOLD
Aries Electronics
 340 $2.17
Lo-PRO®file, 513 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing6 (2 x 3)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
08-2513-11
08-2513-11
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 128 $2.16
Lo-PRO®file, 513 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
09-0513-10H
09-0513-10H
CONN SOCKET SIP 9POS GOLD
Aries Electronics
 275 $2.15
0513 Bulk ActiveSIP9 (1 x 9)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
15-0518-10H
15-0518-10H
CONN SOCKET SIP 15POS GOLD
Aries Electronics
 396 $2.14
518 Bulk ActiveSIP15 (1 x 15)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
16-0518-10T
16-0518-10T
CONN SOCKET SIP 16POS GOLD
Aries Electronics
 436 $2.13
518 Bulk ActiveSIP16 (1 x 16)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
18-1518-10
18-1518-10
CONN IC DIP SOCKET 18POS GOLD
Aries Electronics
 123 $2.14
518 Bulk ActiveDIP, 0.2" (5.08mm) Row Spacing18 (2 x 9)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
614-83-328-31-012101
614-83-328-31-012101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 225 $2.24
614 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleCarrier, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
121-83-324-41-001101
121-83-324-41-001101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
 114 $2.26
121 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing24 (2 x 12)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleOpen FrameWire Wrap0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
115-87-650-41-001101
115-87-650-41-001101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
 129 $2.22
115 Bulk ActiveDIP, 0.6" (15.24mm) Row Spacing50 (2 x 25)0.100" (2.54mm)GoldFlashBeryllium CopperThrough HoleOpen FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
08-3513-00
08-3513-00
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
 98 $2.18
Lo-PRO®file, 513 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing8 (2 x 4)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough HoleClosed FrameSolder0.100" (2.54mm)Tin200.0µin (5.08µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-55°C ~ 105°C
116-83-328-41-018101
116-83-328-41-018101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
 178 $2.27
116 Bulk ActiveDIP, 0.3" (7.62mm) Row Spacing28 (2 x 14)0.100" (2.54mm)Gold29.5µin (0.75µm)Beryllium CopperThrough HoleElevated, Open FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C
10-0513-11
10-0513-11
CONN SOCKET SIP 10POS GOLD
Aries Electronics
 333 $2.12
0513 Bulk ActiveSIP10 (1 x 10)0.100" (2.54mm)Gold10.0µin (0.25µm)Beryllium CopperThrough Hole-Solder0.100" (2.54mm)Gold10.0µin (0.25µm)BrassPolyamide (PA46), Nylon 4/6, Glass Filled-
299-87-610-10-002101
299-87-610-10-002101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
 64 $2.23
299 Tube ActiveDIP, 0.6" (15.24mm) Row Spacing10 (2 x 5)0.100" (2.54mm)GoldFlashBeryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100" (2.54mm)Tin-BrassPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled-55°C ~ 125°C