PDF
Mfr Part #
Quantity Available
UnitPrice
RFQ
Series
Packaging
Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
312
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
420
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
280
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
259
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
523
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
312
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
533
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
29
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
478
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
340
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
263
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
61
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
495
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
367
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
39
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
342
$0.00
Bulk
Obsolete - - - - - - - - - - - - - - -
74
$0.00
Textool™
Bulk
Obsolete PGA, ZIF (ZIP) 256 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
33
$0.00
Textool™
Bulk
Obsolete PGA, ZIF (ZIP) 76 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
486
$0.00
Textool™
Bulk
Obsolete PGA, ZIF (ZIP) 124 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
451
$0.00
Textool™
Bulk
Obsolete PGA, ZIF (ZIP) 209 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C