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Mfr Part #
Quantity Available
UnitPrice
RFQ
Series
Packaging
Product Status Convert From (Adapter End) Convert To (Adapter End) Number of Pins Pitch - Mating Contact Finish - Mating Mounting Type Termination Pitch - Post Contact Finish - Post Housing Material Board Material
16
$15.93
Correct-A-Chip® 350000
Bulk
Active SOIC DIP, 0.3" (7.62mm) Row Spacing 8 0.050" (1.27mm) Tin Through Hole Solder 0.100" (2.54mm) Tin-Lead - Polyimide (PI)
23
$16.05
Correct-A-Chip® 666000
Bulk
Active SOIC SOWIC 8 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
41
$16.03
Correct-A-Chip® 666000
Bulk
Active SOIC SOWIC 14 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
17
$16.38
Correct-A-Chip® 505
Bulk
Active PLCC PGA 28 0.050" (1.27mm) - Through Hole Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
61
$16.17
Correct-A-Chip® 666000
Bulk
Active SOIC SOWIC 10 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
36
$16.71
Textool™
Box
Active DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 32 0.100" (2.54mm) Gold Through Hole Solder 0.100" (2.54mm) Gold Polysulfone (PSU), Glass Filled -
12
$16.77
Correct-A-Chip® 666000
Bulk
Active SOIC SOWIC 18 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
60
$17.02
Correct-A-Chip® 650000
Bulk
Active SOIC DIP, 0.6" (15.24mm) Row Spacing 24 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
27
$16.80
Correct-A-Chip® 350000
Bulk
Active SOIC DIP, 0.3" (7.62mm) Row Spacing 24 0.050" (1.27mm) Tin Through Hole Solder 0.100" (2.54mm) Tin-Lead - Polyimide (PI)
19
$17.29
Correct-A-Chip® 666000
Bulk
Active SOIC SOWIC 20 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
51
$17.33
Correct-A-Chip® 505
Bulk
Active PLCC PGA 44 0.050" (1.27mm) - Through Hole Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
44
$16.98
Correct-A-Chip® 350000
Bulk
Active SOIC DIP, 0.3" (7.62mm) Row Spacing 14 0.050" (1.27mm) Tin Through Hole Solder 0.100" (2.54mm) Tin-Lead - Polyimide (PI)
17
$17.47
Correct-A-Chip® 301296
Bulk
Active SOIC JEDEC 8 0.050" (1.27mm) - Through Hole Solder - Tin-Lead - FR4 Epoxy Glass
21
$17.51
Correct-A-Chip® 305479
Bulk
Active SOIC JEDEC 8 0.050" (1.27mm) - Through Hole Solder - Tin-Lead - FR4 Epoxy Glass
9
$17.33
Correct-A-Chip® 666000
Bulk
Active SOIC SOWIC 22 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
33
$17.35
Correct-A-Chip® 1106396
Bulk
Active DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 36 0.100" (2.54mm) Gold Through Hole Solder 0.100" (2.54mm) Tin Polyamide (PA46), Nylon 4/6, Glass Filled -
16
$17.57
Correct-A-Chip® 1107254
Bulk
Active DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 36 0.100" (2.54mm) Gold Through Hole Solder 0.100" (2.54mm) Tin Polyamide (PA46), Nylon 4/6, Glass Filled -
52
$17.87
Correct-A-Chip® 35W000
Bulk
Active SOIC-W DIP, 0.3" (7.62mm) Row Spacing 18 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
49
$17.88
Correct-A-Chip® 666000
Bulk
Active SOIC SOWIC 24 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
5
$17.60
Correct-A-Chip® 35W000
Bulk
Active SOIC-W DIP, 0.3" (7.62mm) Row Spacing 20 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass