Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Socket adapters allow the use of ICs and transistors of one package type to be used in place of another package type such as adapting an eight-pin DIP package to a JEDEC socket package. Popular surface mount and through-hole packages may be converted to DIP, JEDEC, PGA, PLCC, QFP, SOIC and SOWIC.
Product List
274 Items
PDF
Mfr Part #
Quantity Available
UnitPrice
RFQ
Series
Packaging
Product Status
Convert From (Adapter End)
Convert To (Adapter End)
Number of Pins
Pitch - Mating
Contact Finish - Mating
Mounting Type
Termination
Pitch - Post
Contact Finish - Post
Housing Material
Board Material
1106396-24
SOCKET ADAPTER DIP TO 24DIP 0.6
Aries Electronics
72
$13.62
Correct-A-Chip® 1106396
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
216-3340-09-0602J
SOCKET ADAPTER 16DIP TO 16DIP
3M
8
$23.01
Textool™
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
16
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
220-3342-09-0602J
SOCKET ADAPTER 20DIP TO 20DIP
3M
14
$23.55
Textool™
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
248-1282-29-0602J
RECEPTACLE DIP SOCKET 48POS .6"
3M
9
$36.90
Textool™
Box
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
48
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
28-653000-10
SOCKET ADAPTER PLCC TO 28DIP 0.6
Aries Electronics
22
$41.79
Correct-A-Chip® 653000
Bulk
Active
PLCC
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
1109523
SOCKET ADAPTER DIP TO TO-8
Aries Electronics
60
$13.79
Correct-A-Chip® 1109523
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
JEDEC
8
0.100" (2.54mm)
Gold
Through Hole
Solder
-
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
FR4 Epoxy Glass
228-1277-09-0602J
SOCKET ADAPTER 28DIP TO 28DIP
3M
34
$19.73
Textool™
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
224-1275-29-0602J
RECEPTACLE DIP SOCKET 24POS .6"
3M
8
$23.97
Textool™
Box
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
240-1280-29-0602J
RECEPTACLE DIP SOCKET 40POS .6"
3M
11
$26.16
Textool™
Box
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
224-1275-39-0602J
RECEPTACLE DIP SOCKET 24POS .6"
3M
14
$32.14
Textool™
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
32-653000-10
SOCKET ADAPTER PLCC TO 32DIP 0.6
Aries Electronics
11
$45.24
Correct-A-Chip® 653000
Bulk
Active
PLCC
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
228-4817-09-0602J
RECEPTACLE DIP SOCKET 28POS .4"
3M
21
$25.59
Textool™
Box
Active
DIP, 0.4" (10.16mm) Row Spacing
DIP, 0.4" (10.16mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
232-1285-19-0602J
RECEPTACLE DIP SOCKET 32POS .6"
3M
19
$29.93
Textool™
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
32
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
224-1275-19-0602J
RECEPTACLE DIP SOCKET 24POS .6"
3M
16
$30.51
Textool™
Bulk
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
264-4493-19-0602J
RECEPTACLE DIP SOCKET 64POS .9"
3M
23
$39.46
Textool™
Box
Active
DIP, 0.9" (22.86mm) Row Spacing
DIP, 0.9" (22.86mm) Row Spacing
64
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
16-35W000-11-RC
SOCKET ADAPT SOIC-W TO 16DIP 0.3
Aries Electronics
25
$25.26
Correct-A-Chip® 35W000
Bulk
Active
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
16
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
228-1290-09-0602J
RECEPTACLE DIP SOCKET 28POS .4"
3M
18
$30.36
Textool™
Box
Active
DIP, 0.4" (10.16mm) Row Spacing
DIP, 0.4" (10.16mm) Row Spacing
28
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
240-1280-09-0602J
SOCKET ADAPTER 40DIP TO 40DIP
3M
15
$40.51
Textool™
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
264-4493-09-0602J
SOCKET ADAPTER 64DIP TO 64DIP
3M
18
$44.55
Textool™
Tube
Active
DIP, 0.9" (22.86mm) Row Spacing
DIP, 0.9" (22.86mm) Row Spacing
64
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
220-3342-19-0602J
RECEPTACLE DIP SOCKET 20POS .3"
3M
23
$32.25
Textool™
Box
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
About Sockets for ICs, Transistors - Adapters
What are Sockets for ICs, Transistors - Adapters?
Sockets for ICs, Transistors - Adapters
Sockets for ICs, Transistors - Adapters are essential components in the electronics industry, designed to facilitate the connection between integrated circuits (ICs) or transistors and the broader electronic system. These sockets serve as intermediary interfaces that allow for easy installation, replacement, and testing of ICs and transistors without the need for soldering. By providing a stable and reliable connection, they ensure that the electrical signals are transmitted efficiently between the components and the circuit board. The basic operating principle involves a series of conductive contacts within the socket that align with the pins or leads of the ICs or transistors, ensuring a secure and conductive connection.
Types of Sockets for ICs, Transistors - Adapters
1. DIP Sockets
DIP (Dual In-line Package) sockets are designed for ICs with two parallel rows of pins. They are commonly used in prototyping and testing environments due to their ease of use and ability to accommodate a wide range of IC sizes. DIP sockets provide a secure connection while allowing for easy removal and replacement of ICs, making them ideal for applications where frequent changes are necessary.
2. ZIF Sockets
ZIF (Zero Insertion Force) sockets are engineered to minimize the force required to insert or remove ICs, reducing the risk of damage to the components. These sockets use a lever mechanism to open and close the contacts, ensuring a firm grip on the IC pins when engaged. ZIF sockets are particularly useful in environments where ICs are frequently swapped or tested.
3. PGA Sockets
PGA (Pin Grid Array) sockets are designed for ICs with a grid of pins on the underside. These sockets are typically used for microprocessors and other high-pin-count devices. PGA sockets provide a robust connection and are often used in applications requiring high reliability and performance.
4. BGA Sockets
BGA (Ball Grid Array) sockets accommodate ICs with an array of solder balls on the bottom. These sockets are used in high-density applications where space is at a premium. BGA sockets offer excellent electrical performance and are commonly found in advanced computing and telecommunications equipment.
How to choose Sockets for ICs, Transistors - Adapters?
When selecting sockets for ICs, transistors - adapters, several key parameters should be considered:
Compatibility: Ensure the socket is compatible with the IC or transistor package type and pin configuration.
Pin Count: Match the socket's pin count with that of the IC or transistor to ensure proper alignment and connectivity.
Material Quality: Look for sockets made from high-quality materials that offer good conductivity and durability.
Environmental Factors: Consider the operating environment, such as temperature and humidity, to select sockets with appropriate ratings.
Installation Requirements: Evaluate the ease of installation and removal, especially if frequent changes are anticipated.
To assess product quality and reliability, review supplier certifications, customer reviews, and performance specifications. Additionally, consider the supplier's track record in the industry and their ability to provide technical support and after-sales service.
Applications of Sockets for ICs, Transistors - Adapters
1. Consumer Electronics
In consumer electronics, sockets for ICs and transistors are used in devices such as televisions, smartphones, and gaming consoles. They allow for easy upgrades and repairs, enhancing the longevity and functionality of these products.
2. Automotive Industry
The automotive industry utilizes these sockets in electronic control units (ECUs) and other onboard systems. They provide reliable connections in harsh environments, ensuring the performance and safety of automotive electronics.
3. Telecommunications
In telecommunications, sockets are used in network infrastructure equipment like routers and switches. They facilitate quick component swaps and upgrades, maintaining network reliability and performance.
4. Aerospace and Defense
Aerospace and defense applications demand high-reliability sockets for mission-critical systems. These sockets are used in avionics and communication systems, where they must withstand extreme conditions and ensure uninterrupted operation.
5. Industrial Automation
In industrial automation, sockets are employed in control systems and machinery. They enable easy maintenance and upgrades, reducing downtime and enhancing the efficiency of automated processes.
