Overview
The BAS70-04-G3-08 is a general-purpose dual Schottky diode produced by Vishay General Semiconductor - Diodes Division. This component is housed in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package, making it suitable for a wide range of applications where compact size and high performance are required.
The diode array features a series connection configuration, offering high switching speed, low leakage current, and high breakdown voltage. These characteristics make it an ideal choice for various electronic designs, particularly in automotive, industrial, and consumer electronics.
Key Specifications
| Parameter | Value | Unit |
|---|---|---|
| Diode Configuration | 1 Pair Series Connection | |
| Package | SOT23 (TO-236AB) | |
| Maximum Reverse Voltage (VR) | 70.0 | V |
| Maximum Forward Current (IF) | 200 | mA |
| Maximum Capacitance (Cd) | 2.0 | pF |
| Maximum Reverse Leakage Current (IR) | 0.1 | µA |
| Package Dimensions | 2.9 x 1.3 x 1 | mm |
| Weight | Approx. 9.2 mg | |
| Moisture Sensitivity Level (MSL) | 1 | |
| Flammability Rating | UL 94 V-0 |
Key Features
- Very low turn-on voltage and fast switching speed, making it suitable for high-frequency applications.
- High breakdown voltage of 70 V and maximum forward current of 200 mA.
- Low leakage current and low capacitance, enhancing overall efficiency and performance.
- Protected by a PN junction, ensuring robust operation.
- AEC-Q101 qualified versions available upon request, suitable for automotive applications.
- Molding compound meets UL 94 V-0 flammability rating, ensuring safety in various environments.
- Moisture Sensitivity Level (MSL) 1, reducing the risk of moisture-related failures.
Applications
The BAS70-04-G3-08 is versatile and can be used in a variety of applications across different industries:
- Automotive: Suitable for automotive systems due to its AEC-Q101 qualified versions and robust performance.
- Industrial: Used in industrial control systems, power supplies, and other high-reliability applications.
- Consumer Electronics: Ideal for use in mobile devices, wearables, and other consumer electronics where compact size and high performance are crucial.
- Power and Computing: Utilized in power management circuits, computing devices, and other high-speed switching applications.
Q & A
- What is the package type of the BAS70-04-G3-08?
The BAS70-04-G3-08 is housed in a SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.
- What is the maximum reverse voltage of the BAS70-04-G3-08?
The maximum reverse voltage (VR) is 70 V.
- What is the maximum forward current of the BAS70-04-G3-08?
The maximum forward current (IF) is 200 mA.
- What are the key features of the BAS70-04-G3-08?
The key features include very low turn-on voltage, fast switching speed, high breakdown voltage, low leakage current, and low capacitance.
- Is the BAS70-04-G3-08 AEC-Q101 qualified?
AEC-Q101 qualified versions are available upon request, making it suitable for automotive applications.
- What is the moisture sensitivity level (MSL) of the BAS70-04-G3-08?
The moisture sensitivity level (MSL) is 1.
- What is the flammability rating of the BAS70-04-G3-08?
The molding compound meets UL 94 V-0 flammability rating.
- In what types of applications is the BAS70-04-G3-08 commonly used?
It is commonly used in automotive, industrial, consumer electronics, power, and computing applications..
- How is the BAS70-04-G3-08 packaged?
The component is packaged in tape and reel (TR) format, with options for 3,000 units per 7” reel or 10,000 units per 13” reel.
- What is the weight of the BAS70-04-G3-08?
The weight of the component is approximately 9.2 mg..
