Overview
The TPD4E1B06DCKR is a 4-channel bi-directional Electrostatic Discharge (ESD) protection diode array produced by Texas Instruments. This device is designed to provide robust protection against ESD events, making it suitable for a wide range of high-speed interfaces. It features ultra-low leakage current, transient protection for four I/O lines, and low ESD clamping voltage, ensuring the integrity of system components during ESD events.
Key Specifications
| Parameter | Test Condition | Min | Max | Unit | |
|---|---|---|---|---|---|
| VRWM (Reverse stand-off voltage) | - | -5.5 | 5.5 | 5.5 | V |
| VCLAMP (Clamp voltage with ESD strike, IO to GND) | IPP = 1 A, tp = 8/20 μSec | - | 10.9 | - | V |
| VCLAMP (Clamp voltage with ESD strike, IO to GND) | IPP = 3 A, tp = 8/20 μSec | - | 14.5 | - | V |
| RDYN (Dynamic resistance) | ITLP = 10 A to 20 A, I/O to GND | - | 1 | - | Ω |
| CL (Line capacitance) | f = 1 MHz, VBIAS = 2.5 V | 0.7 | 0.95 | - | pF |
| VBR (Break-down voltage) | IIO = 1 mA, from I/O to GND or GND to I/O | 7 | - | 9.5 | V |
| ILEAK (Leakage current) | VIO = 2.5 V | - | - | 0.5 | nA |
| Operating temperature range | - | -40 | - | 125 | °C |
Key Features
- Ultra Low Leakage Current: Maximum leakage current of 0.5 nA, supporting long battery life and precision analog measurements.
- Transient Protection for 4 I/O Lines: Withstands ESD events up to ±12 kV contact and ±15 kV air gap per IEC 61000-4-2.
- I/O Capacitance: Ultra-low 0.7 pF capacitance, making it suitable for high-speed interfaces such as USB2.0, Ethernet, SATA, LVDS, and 1394.
- Bi-Directional ESD Protection Diode Array: Uses back-to-back diode topology to accommodate bi-directional signaling between –5.5 V and 5.5 V.
- Low ESD Clamping Voltage: Clamps ESD events to a safe level to protect system components.
- Industrial Temperature Range: Operates from –40°C to 125°C.
- Small, Easy-to-Route Packages: Available in DRL and DCK packages.
Applications
- Glucose meters
- Tablets
- GPS devices
- Portable media players
- TVs
- Set-top boxes
- Precision analog, USB2.0, Ethernet, SATA, LVDS, and 1394 interfaces
The TPD4E1B06DCKR is typically used to provide a path to ground for dissipating ESD events on high-speed signal lines between a human interface connector and a system.
Q & A
- What is the maximum leakage current of the TPD4E1B06DCKR?
The maximum leakage current is 0.5 nA.
- What level of ESD protection does the TPD4E1B06DCKR offer?
The device withstands ESD events up to ±12 kV contact and ±15 kV air gap per IEC 61000-4-2.
- What is the typical I/O capacitance of the TPD4E1B06DCKR?
The typical I/O capacitance is 0.7 pF.
- What is the operating temperature range of the TPD4E1B06DCKR?
The operating temperature range is from –40°C to 125°C.
- What types of packages are available for the TPD4E1B06DCKR?
The device is available in DRL and DCK packages.
- What are some common applications for the TPD4E1B06DCKR?
Common applications include glucose meters, tablets, GPS devices, portable media players, TVs, and set-top boxes.
- How does the TPD4E1B06DCKR protect against ESD events?
The device uses a bi-directional ESD protection diode array to clamp ESD events to a safe level and protect system components.
- What is the dynamic resistance of the TPD4E1B06DCKR during an ESD event?
The dynamic resistance is approximately 1 Ω for I/O to GND and 0.8 Ω for GND to I/O.
- Can the TPD4E1B06DCKR be used in high-speed interfaces?
Yes, it is suitable for high-speed interfaces such as USB2.0, Ethernet, SATA, LVDS, and 1394 due to its ultra-low capacitance.
- How should the TPD4E1B06DCKR be connected in a system?
The device should be placed between the connector and the system, with the I/O pins connected to the data lines as close to the connector as possible.
