TMS32C6414EGLZA6E3
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Texas Instruments TMS32C6414EGLZA6E3

Manufacturer No:
TMS32C6414EGLZA6E3
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC FIXED POINT DSP 532-FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The TMS320C6414EGLZA6E3 is a fixed-point digital signal processor (DSP) from Texas Instruments, part of the C64x DSP family. This processor is designed for high-performance applications requiring intensive signal processing. Although it is now obsolete and no longer in production, it remains a significant component in legacy systems. The C6414 features a powerful DSP core, extensive memory, and a variety of peripherals, making it suitable for a range of applications including telecommunications, audio processing, and industrial control.

Key Specifications

SpecificationDetails
Processor CoreC64x Fixed-Point DSP
Maximum Clock FrequencyUp to 600 MHz
Package Type532-Pin Ball Grid Array (BGA)
Cache Memory128K-Bit L1 Program Cache (Direct Mapped), 128K-Bit L1 Data Cache (2-Way Set-Associative), 8M-Bit L2 Unified Mapped RAM/Cache
External Memory Interfaces64-Bit EMIFA, 16-Bit EMIFB
Peripheral InterfacesThree Multichannel Buffered Serial Ports (McBSPs), Enhanced Direct-Memory-Access (EDMA) Controller (64 independent channels), Host-Port Interface (HPI)
TimersThree 32-Bit General-Purpose Timers
GPIOSixteen General-Purpose Input/Output (GPIO) Pins
VoltageCore: 1.4 V, I/O: 3.3 V
Process Technology0.13 µm

Key Features

  • High-Performance DSP Core: Supports up to four 16 x 16-bit multiplies or eight 8 x 8-bit multiplies per clock cycle.
  • Instruction Set: Features instruction packing, conditional instructions, byte-addressable data, and various bit manipulation instructions.
  • Memory Architecture: Includes Level 1 and Level 2 caches, and flexible external memory interfaces.
  • Peripheral Set: Includes McBSPs, EDMA controller, HPI, and GPIO pins.
  • Clock and Voltage: Flexible PLL clock generator and support for various voltage levels.
  • Development Tools: Advanced C compiler, assembly optimizer, and Windows debugger interface.

Applications

The TMS320C6414EGLZA6E3 is suited for a variety of high-performance signal processing applications, including:

  • Telecommunications: Supports protocols like AMR and 3GPP, making it ideal for wireless and wired communication systems.
  • Audio Processing: Capable of handling complex audio algorithms due to its high processing power.
  • Industrial Control: Used in control systems that require real-time signal processing and high reliability.
  • Medical Devices: Can be used in medical imaging and diagnostic equipment due to its precision and speed.

Q & A

  1. What is the maximum clock frequency of the TMS320C6414EGLZA6E3?
    The maximum clock frequency is up to 600 MHz.
  2. What type of package does the TMS320C6414EGLZA6E3 use?
    The processor uses a 532-Pin Ball Grid Array (BGA) package.
  3. What is the cache memory configuration of the TMS320C6414EGLZA6E3?
    The processor has a 128K-Bit L1 Program Cache, a 128K-Bit L1 Data Cache, and an 8M-Bit L2 Unified Mapped RAM/Cache.
  4. Does the TMS320C6414EGLZA6E3 support external memory interfaces?
    Yes, it supports 64-Bit EMIFA and 16-Bit EMIFB external memory interfaces.
  5. What peripherals are available on the TMS320C6414EGLZA6E3?
    The processor includes McBSPs, EDMA controller, HPI, and GPIO pins among others.
  6. Is the TMS320C6414EGLZA6E3 still in production?
    No, the TMS320C6414EGLZA6E3 is obsolete and no longer in production.
  7. What are some common applications of the TMS320C6414EGLZA6E3?
    Common applications include telecommunications, audio processing, industrial control, and medical devices.
  8. What is the process technology used in the TMS320C6414EGLZA6E3?
    The processor is manufactured using 0.13 µm process technology.
  9. Does the TMS320C6414EGLZA6E3 support PCI interface?
    No, the PCI interface is available on the C6415 and C6416 models but not on the C6414.
  10. What development tools are available for the TMS320C6414EGLZA6E3?
    Available tools include an advanced C compiler, assembly optimizer, and a Windows debugger interface.

Product Attributes

Type:Fixed Point
Interface:Host Interface, McBSP
Clock Rate:600MHz
Non-Volatile Memory:External
On-Chip RAM:1.03MB
Voltage - I/O:3.30V
Voltage - Core:1.40V
Operating Temperature:-40°C ~ 105°C (TC)
Mounting Type:Surface Mount
Package / Case:532-BFBGA, FCBGA
Supplier Device Package:532-FCBGA (23x23)
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Similar Products

Part Number TMS32C6414EGLZA6E3 TMS32C6416EGLZA6E3 TMS32C6414EZLZA6E3 TMS32C6415EGLZA6E3 TMS32C6414EGLZ6E3
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Active
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface Host Interface, McBSP Host Interface, McBSP, PCI, UTOPIA Host Interface, McBSP Host Interface, McBSP, PCI, UTOPIA Host Interface, McBSP
Clock Rate 600MHz 600MHz 600MHz 600MHz 600MHz
Non-Volatile Memory External External External External External
On-Chip RAM 1.03MB 1.03MB 1.03MB 1.03MB 1.03MB
Voltage - I/O 3.30V 3.30V 3.30V 3.30V 3.30V
Voltage - Core 1.40V 1.40V 1.40V 1.40V 1.40V
Operating Temperature -40°C ~ 105°C (TC) -40°C ~ 105°C (TC) -40°C ~ 105°C (TC) -40°C ~ 105°C (TC) 0°C ~ 90°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 532-BFBGA, FCBGA 532-BFBGA, FCBGA 532-BFBGA, FCBGA 532-BFBGA, FCBGA 532-BFBGA, FCBGA
Supplier Device Package 532-FCBGA (23x23) 532-FCBGA (23x23) 532-FCBGA (23x23) 532-FCBGA (23x23) 532-FCBGA (23x23)

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