TMS320F28376DZWTT
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Texas Instruments TMS320F28376DZWTT

Manufacturer No:
TMS320F28376DZWTT
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC MCU 32BIT 512KB FLSH 337NFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TMS320F28376DZWTT is a powerful 32-bit floating-point microcontroller unit (MCU) from Texas Instruments, part of the C2000™ microcontroller family. This MCU is designed for advanced closed-loop control applications, including industrial motor drives, solar inverters and digital power, electrical vehicles and transportation, and sensing and signal processing. The device features a dual-core architecture with two TMS320C28x 32-bit CPUs, each operating at 200 MHz, and includes IEEE 754 single-precision Floating-Point Units (FPUs), Trigonometric Math Units (TMUs), and Viterbi/Complex Math Units (VCU-II). The MCU also integrates two programmable Control Law Accelerators (CLAs) that execute code independently of the main CPU, enhancing real-time control performance.

Key Specifications

Specification Details
Processor Dual-core TMS320C28x 32-bit CPUs, 200 MHz each
Floating-Point Unit IEEE 754 single-precision FPU
Math Units Trigonometric Math Unit (TMU), Viterbi/Complex Math Unit (VCU-II)
Control Law Accelerators Two programmable CLAs, 200 MHz, IEEE 754 single-precision floating-point instructions
Memory 512KB (256KW) or 1MB (512KW) of ECC-protected flash, 172KB (86KW) or 204KB (102KW) of ECC-protected or parity-protected RAM
Analog Peripherals Four independent 16-bit ADCs, sigma-delta filter module (SDFM), Comparator Subsystem (CMPSS) with windowed comparators
Control Peripherals 24 PWM channels, 16 high-resolution PWM channels, six enhanced capture (eCAP) modules, three enhanced quadrature encoder pulse (eQEP) modules
Communication Peripherals Dual CAN modules, I2C, McBSP, SCI, SPI, USB
Package Options 337-Ball New Fine Pitch Ball Grid Array (nFBGA), 176-Pin PowerPAD™ Thermally Enhanced Low-Profile Quad Flatpack (HLQFP), 100-Pin PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP)
Temperature Options T: –40°C to 105°C, S: –40°C to 125°C, Q: –40°C to 150°C

Key Features

  • Dual-core architecture with two TMS320C28x 32-bit CPUs operating at 200 MHz.
  • IEEE 754 single-precision Floating-Point Units (FPUs) and Trigonometric Math Units (TMUs) for enhanced mathematical processing.
  • Two programmable Control Law Accelerators (CLAs) that execute code independently of the main CPU, enhancing real-time control performance.
  • Integrated analog and control peripherals, including four independent 16-bit ADCs, sigma-delta filter modules, and Comparator Subsystems with windowed comparators.
  • Performance control peripherals such as 24 PWM channels, 16 high-resolution PWM channels, eCAP modules, and eQEP modules.
  • Dual-zone security supporting third-party development and unique identification numbers.
  • Various communication peripherals including dual CAN modules, I2C, McBSP, SCI, SPI, and USB.
  • Multiple package options and temperature ranges to suit different application needs.

Applications

  • Industrial motor drives: The MCU's advanced control capabilities make it ideal for high-performance motor control applications.
  • Solar inverters and digital power: The integrated analog and control peripherals are well-suited for solar inverter and digital power systems.
  • Electrical vehicles and transportation: The MCU's real-time control capabilities and robust peripherals make it suitable for electric vehicle and transportation systems.
  • Sensing and signal processing: The device's advanced mathematical processing units and analog peripherals are beneficial for sensing and signal processing applications.

Q & A

  1. What is the core architecture of the TMS320F28376DZWTT?

    The TMS320F28376DZWTT features a dual-core architecture with two TMS320C28x 32-bit CPUs, each operating at 200 MHz.

  2. What are the key mathematical processing units integrated into this MCU?

    The MCU includes IEEE 754 single-precision Floating-Point Units (FPUs), Trigonometric Math Units (TMUs), and Viterbi/Complex Math Units (VCU-II).

  3. What is the role of the Control Law Accelerators (CLAs) in this MCU?

    The CLAs are independent 32-bit floating-point processors that execute code concurrently with the main CPU, enhancing real-time control performance.

  4. What types of memory are available on the TMS320F28376DZWTT?

    The MCU has 512KB (256KW) or 1MB (512KW) of ECC-protected flash and 172KB (86KW) or 204KB (102KW) of ECC-protected or parity-protected RAM.

  5. What are the key analog peripherals integrated into this MCU?

    The MCU includes four independent 16-bit ADCs, sigma-delta filter modules, and Comparator Subsystems with windowed comparators.

  6. What are the primary control peripherals available on this device?

    The device features 24 PWM channels, 16 high-resolution PWM channels, six enhanced capture (eCAP) modules, and three enhanced quadrature encoder pulse (eQEP) modules.

  7. What communication peripherals are supported by the TMS320F28376DZWTT?

    The MCU supports dual CAN modules, I2C, McBSP, SCI, SPI, and USB.

  8. What are the package and temperature options for this MCU?

    The MCU is available in 337-Ball New Fine Pitch Ball Grid Array (nFBGA), 176-Pin PowerPAD™ Thermally Enhanced Low-Profile Quad Flatpack (HLQFP), and 100-Pin PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP) packages, with temperature options ranging from –40°C to 105°C, –40°C to 125°C, and –40°C to 150°C.

  9. What are some typical applications for the TMS320F28376DZWTT?

    The MCU is typically used in industrial motor drives, solar inverters and digital power systems, electrical vehicles and transportation, and sensing and signal processing applications.

  10. Are there any software development kits available for this MCU?

Product Attributes

Core Processor:C28x
Core Size:32-Bit Dual-Core
Speed:200MHz
Connectivity:CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:DMA, POR, PWM, WDT
Number of I/O:169
Program Memory Size:512KB (256K x 16)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:86K x 16
Voltage - Supply (Vcc/Vdd):1.14V ~ 3.47V
Data Converters:A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TJ)
Mounting Type:Surface Mount
Package / Case:337-LFBGA
Supplier Device Package:337-NFBGA (16x16)
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Similar Products

Part Number TMS320F28376DZWTT TMS320F28379DZWTT TMS320F28377DZWTT TMS320F28376SZWTT TMS320F28374DZWTT TMS320F28375DZWTT TMS320F28376DZWTS
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Active Active Active
Core Processor C28x C28x C28x C28x C28x C28x C28x
Core Size 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Single-Core 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core
Speed 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz 200MHz
Connectivity CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 169 169 169 169 169 169 169
Program Memory Size 512KB (256K x 16) 1MB (512K x 16) 1MB (512K x 16) 512KB (256K x 16) 512KB (256K x 16) 1MB (512K x 16) 512KB (256K x 16)
Program Memory Type Flash Flash Flash Flash Flash Flash Flash
EEPROM Size - - - - - - -
RAM Size 86K x 16 102K x 16 102K x 16 66K x 16 86K x 16 102K x 16 86K x 16
Voltage - Supply (Vcc/Vdd) 1.14V ~ 3.47V 1.14V ~ 3.47V 1.14V ~ 3.47V 1.14V ~ 3.47V 1.14V ~ 3.47V 1.14V ~ 3.47V 1.14V ~ 3.47V
Data Converters A/D 24x12b, 12x16b; D/A 3x12b A/D 24x12b, 12x16b; D/A 3x12b A/D 24x12b, 12x16b; D/A 3x12b A/D 24x12b, 12x16b; D/A 3x12b A/D 24x12b; D/A 3x12b A/D 24x12b; D/A 3x12b A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type Internal Internal Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 125°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 337-LFBGA 337-LFBGA 337-LFBGA 337-LFBGA 337-LFBGA 337-LFBGA 337-LFBGA
Supplier Device Package 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16) 337-NFBGA (16x16)

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